Micro-LED chips and methods for manufacturing the same and display devices
AssigneeChengdu Vistar Optoelectronics Co., Ltd.
InventorsFeng Zhai, Huimin Liu, Tao Wang
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Abstract
The present disclosure relates to micro-LED chips, methods for manufacturing the same, and display devices. The micro-LED chip includes: a driving backplane including at least one first electrode, a groove being provided above the first electrode, and the first electrode being located at a bottom of the groove; the groove being filled with a conductive material, and the conductive material being obtained by curing a corresponding conductive ink; and a light emitting chip including at least one second electrode; and the first electrode is connected to the second electrode through the conductive material.
Claims19
A micro-LED chip, comprising:
- a driving backplane comprising at least one first electrode, at least a groove provided above the first electrode, and the first electrode located at a bottom of the groove, the groove being filled with a conductive material, the conductive material being obtained by curing a corresponding conductive ink;
- and
- a light emitting chip comprising a second electrode;
- wherein the first electrode is connected to the second electrode through the conductive material.
A method for manufacturing a micro-LED chip, comprising:
- providing a driving backplane and a light emitting chip, wherein the driving backplane comprises a first electrode, and wherein the light emitting chip comprises a second electrode;
- forming at least a groove above the first electrode, wherein the first electrode is exposed at a bottom of the groove;
- printing a conductive ink into the groove;
- aligning and contacting the second electrode with the conductive ink in the groove;
- and
- curing the conductive ink, the second electrode being connected to the first electrode through the cured conductive ink.
Dependencies are inferred from the claim text.