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US 11,081,631 B2Granted
Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same
AssigneeMaven Optronics Co., Ltd.
InventorsChieh Chen, Chia-Hsien Chang
Life of this patent
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Abstract
An asymmetrically shaped chip-scale packaging (CSP) light-emitting device (LED) includes an LED chip, a photoluminescent structure (or a light-transmitting structure), and a reflective structure. The photoluminescent structure covers the upper surface and/or the edge surface of the LED chip; and the reflective structure at least partially covers the edge surface of the photoluminescent structure. The reflective structure partially reflects the primary light emitted from the edge surface of the LED chip or the converted secondary light radiated from the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically.
Claims23
A light-emitting device comprising:
- a light-emitting chip comprising an upper surface, a lower surface opposite to the upper surface, an edge surface and a set of electrodes, wherein the edge surface extends between the upper surface and the lower surface, the set of electrodes is disposed on the lower surface, and the set of electrodes and the lower surface form a lower electrode surface;
- an optical structure comprising a top surface, a bottom surface opposite to the top surface, and a side surface, wherein the side surface extends between the top surface and the bottom surface, and the optical structure covers the upper surface of the light-emitting chip, the edge surface of the light-emitting chip, or both, wherein the optical structure is a photoluminescent structure or a light-transmitting structure;
- and
- a reflective structure partially covering the side surface of the optical structure;
- wherein:
- a first horizontal direction and a second horizontal direction perpendicular to each other are specified along a length direction and a width direction on the upper surface of the light-emitting chip, respectively;
- and
- the side surface of the optical structure comprises four vertical side surfaces;
- wherein:
- two vertical side surfaces of the four vertical side surfaces are oppositely disposed substantially perpendicular to the first horizontal direction;
- and
- another two vertical side surfaces of the four vertical side surfaces are oppositely disposed substantially perpendicular to the second horizontal direction;
- wherein:
- the two vertical side surfaces substantially perpendicular to the first horizontal direction are not covered by the reflective structure to form two side light-emitting surfaces;
- one of the vertical side surfaces substantially perpendicular to the second horizontal direction is covered by the reflective structure to form a side reflective surface;
- another of the vertical side surfaces substantially perpendicular to the second horizontal direction is not covered by the reflective structure to form a side light-emitting surface;
- and
- the side light-emitting surfaces of the light-emitting device and the lower electrode surface of the light-emitting chip are substantially perpendicular to each other;
- wherein a distance between the side reflective surface and the edge surface of the light-emitting chip along the second horizontal direction is smaller than a distance between the side light-emitting surface and the edge surface of the light-emitting chip along the second horizontal direction.
16 more elements
A method of manufacturing a light-emitting device, comprising:
- disposing an optical structure to cover an upper surface of a light-emitting chip, an edge surface of the light-emitting chip, or both;
- and
- forming a reflective structure to partially cover a side surface of the optical structure;
- wherein:
- a first horizontal direction and a second horizontal direction are specified along a length direction and a width direction on the upper surface of the light-emitting chip, respectively;
- and
- the side surface of the optical structure comprises four vertical side surfaces;
- wherein:
- two vertical side surfaces of the four vertical side surfaces are oppositely disposed substantially perpendicular to the first horizontal direction;
- and
- another two vertical side surfaces of the four vertical side surfaces are oppositely disposed substantially perpendicular to the second horizontal direction;
- wherein:
- the two vertical side surfaces substantially perpendicular to the first horizontal direction are not covered by the reflective structure to form two side light-emitting surfaces;
- one of the vertical side surfaces substantially perpendicular to the second horizontal direction is covered by the reflective structure to form a side reflective surface;
- and
- another of the vertical side surfaces substantially perpendicular to the second horizontal direction is not covered by the reflective structure to form a side light-emitting surface;
- wherein a distance between the side reflective surface and the edge surface of a light-emitting chip along the second horizontal direction is smaller than a distance between the side light-emitting surface and the edge surface of a light-emitting chip along the second horizontal direction.
14 more elements
Dependencies are inferred from the claim text.