Packaged LEDs with phosphor films, and associated systems and methods
AssigneeMicron Technology, Inc.
InventorJonathon G. Greenwood
Life of this patent
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Abstract
Packaged LEDs with phosphor films, and associated systems and methods are disclosed. A system in accordance with a particular embodiment of the disclosure includes a support member having a support member bond site, an LED carried by the support member and having an LED bond site, and a wire bond electrically connected between the support member bond site and the LED bond site. The system can further include a phosphor film carried by the LED and the support member, the phosphor film being positioned to receive light from the LED at a first wavelength and emit light at a second wavelength different than the first. The phosphor film can be positioned in direct contact with the wire bond at the LED bond site.
Claims18
A method for manufacturing an LED system, the method comprising:
- mounting an LED to a support member;
- electrically connecting the LED to the support member with a wire bond;
- electrically connecting the LED to an electrostatic discharge (ESD) die, wherein the ESD die is electrically coupled to the support member with an inner wire bond, and wherein the inner wire bond is positioned between the wire bond and the support member;
- providing a self-supporting phosphor film having a nonuniform distribution of phosphor elements;
- conforming the phosphor film to the wire bond such that the phosphor film contacts at least a portion of the wire bond between the LED and the support member;
- and
- attaching the phosphor film to the LED and the support member.
A method for manufacturing a semiconductor device, the method comprising:
- providing a support member and an LED disposed on the support member;
- providing a self-supporting phosphor film having a nonuniform distribution of phosphor elements;
- electrically coupling the LED to the support member via a wire bond;
- electrically connecting the LED to an electrostatic discharge (ESD) die, wherein the ESD die is electrically coupled to the support member with an inner wire bond, and wherein the inner wire bond is positioned between the wire bond and the support member;
- and
- disposing the phosphor film over at least a portion of the wire bond, the inner wire bond, the LED, and the support member, wherein the disposed phosphor film is in contact with the wire bond.
Dependencies are inferred from the claim text.