Memory modules and memory packages including graphene layers for thermal management

An apparatus, comprising:

• a printed circuit board (PCB) that comprises a layer of graphene, an edge connector and a plurality of electrical pads operably coupled to the edge connector;
• and
• a plurality of memory devices, each of the memory devices comprising a plurality of electrical contacts, each of the electrical contacts operably coupled to a corresponding one of the plurality of electrical pads,
• wherein the layer of graphene is in contact with the plurality of memory devices and configured to convey thermal energy away from the memory devices, the layer of graphene including a plurality of openings corresponding to and exposing the plurality of electrical pads of each of the plurality of memory devices.

A semiconductor device package, comprising:

• a substrate including a plurality of substrate pads;
• a semiconductor die including a plurality of electrical contacts, each one of the plurality of electrical contacts operably coupled to a corresponding one of the plurality of substrate pads;
• and
• a layer of graphene between the substrate and the semiconductor die and in contact with the semiconductor die, the layer of graphene including a plurality of openings corresponding to and exposing the plurality of substrate pads, the layer of graphene configured to convey thermal energy away from the semiconductor die.