Memory devices and methods of forming memory devices
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsCurtis Chun-I Hsieh, Wei-Hui Hsu, Yi Jiang, Wanbing Yi, Juan Boon Tan
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AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsCurtis Chun-I Hsieh, Wei-Hui Hsu, Yi Jiang, Wanbing Yi, Juan Boon Tan
Estimating the term…
A memory device may be provided, including a base layer, an insulating layer, a first electrode, a switching element, a capping element and a second electrode. The insulating layer may be arranged over the base layer and may include a recess having opposing side walls. The first electrode may be arranged at least partially within the recess of the insulating layer and along the opposing side walls of the recess of the insulating layer. The switching element may be arranged at least partially within the recess of the insulating layer and along the first electrode. The capping element and the second electrode may be arranged at least partially within the recess of the insulating layer. The capping element may be arranged between the second electrode and the switching element, and a part of the second electrode may extend across the capping element to contact the switching element.
A memory device comprising:
A method comprising:
Dependencies are inferred from the claim text.