Image sensor
AssigneeSamsung Electronics Co., Ltd.
InventorsHan-seok Kim, Byung-jun Park, Hee-geun Jeong, Seung-joo Nah
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsHan-seok Kim, Byung-jun Park, Hee-geun Jeong, Seung-joo Nah
Estimating the term…
A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
An image sensor comprising:
An image sensor comprising:
An image sensor comprising:
Dependencies are inferred from the claim text.