Photosensitive module having transparent plate and image sensor
AssigneeTDK Taiwan Corp.
InventorsChen-Er Hsu, Sin-Jhong Song
Life of this patent
Estimating the term…
Abstract
A photosensitive module is provided, which can be disposed in an electronic device for receiving light passing through a lens in the electronic device, including a base assembly, an image sensor, a first plastic member and a transparent plate. The base assembly includes a substrate, and the substrate has a main body including a metal material. The image sensor is disposed on the base assembly and adjacent to the main body of the substrate. The first plastic member is connected to the base assembly and configured to protect the image sensor. The transparent plate is located on the first plastic member. When the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.
Claims18
A photosensitive module, configured to receive light passing through a lens, comprising:
- a base assembly, including a substrate, and the substrate has a main body including a metal material;
- an image sensor, disposed on the base assembly and adjacent to the main body of the substrate;
- a first plastic member, connected to the base assembly and configured to protect the image sensor;
- a transparent plate, located on the first plastic member;
- and
- a thermal conductive adhesive disposed between the substrate and the image sensor;
- wherein when the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor;
- wherein the base assembly further includes a first insulating layer, a circuit layer and a second insulating layer, wherein the first insulating layer is disposed between the substrate and the circuit layer, the circuit layer is disposed between the first insulating layer and the second insulating layer, the second insulating layer exposes at least one electrical connection point of the circuit layer, and the electrical connection point is electrically connected to the image sensor;
- wherein the first insulating layer and the second insulating layer each have an opening, and the thermal conductive adhesive is disposed in the openings and is in contact with the image sensor through the openings.
A photosensitive module, configured to receive light passing through a lens, comprising:
- a base assembly, including a substrate, and the substrate has a main body including a metal material;
- an image sensor, disposed on the base assembly and adjacent to the main body of the substrate;
- a first plastic member, connected to the base assembly and configured to protect the image sensor;
- a transparent plate, located on the first plastic member;
- a lead assembly, connecting the image sensor to the base assembly;
- and
- a second plastic member, connected to and disposed outside the first plastic member, and the second plastic member carries the transparent plate, wherein the lead assembly is disposed outside the first plastic member and covered by the second plastic member and not in contact with the first plastic member;
- wherein when the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.
A photosensitive module, configured to receive light passing through a lens, comprising:
- a base assembly, including a substrate, and the substrate has a main body including a metal material;
- an image sensor, disposed on the base assembly and adjacent to the main body of the substrate;
- a first plastic member, connected to the base assembly and configured to protect the image sensor;
- a transparent plate, located on the first plastic member;
- a lead assembly, connecting the image sensor to the base assembly;
- and
- a second plastic member, connected to and disposed inside the first plastic member, and the second plastic member sustains the transparent plate, wherein the lead assembly is covered by the second plastic member and is not in contact with the first plastic member;
- wherein when the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.
A photosensitive module, configured to receive light passing through a lens, comprising:
- a base assembly, including a substrate, and the substrate has a main body including a metal material;
- an image sensor, disposed on the base assembly and adjacent to the main body of the substrate;
- a first plastic member, connected to the base assembly and configured to protect the image sensor;
- a transparent plate, located on the first plastic member;
- and
- a second plastic member, disposed on the first plastic member, wherein the transparent plate is located between the first plastic member and the second plastic member, and the transparent plate is disposed on the second plastic member and not in contact with the first plastic member;
- wherein when the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.
A photosensitive module, configured to receive light passing through a lens, comprising:
- a base assembly, including a substrate, and the substrate has a main body including a metal material;
- an image sensor, disposed on the base assembly and adjacent to the main body of the substrate;
- a first plastic member, connected to the base assembly and configured to protect the image sensor;
- a transparent plate, located on the first plastic member;
- and
- a vibration assembly, disposed on the first plastic member and configured to drive the transparent plate, wherein at least a portion of the vibration assembly overlaps the image sensor when viewed from the light-incident direction;
- a plurality of transparent plates, arranged along the light-incident direction, and the vibration assembly drives the transparent plate which is farther from the image sensor.
Dependencies are inferred from the claim text.