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US 11,081,503 B2Granted
Array substrate and method of mounting integrated circuit using the same
AssigneeSamsung Display Co., Ltd.
InventorDae Geun Lee
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Abstract
An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.
Claims10
An electronic device, comprising:
- an array substrate;
- a pad portion disposed on the array substrate;
- and
- an integrated circuit disposed on the pad portion and comprising a bump portion;
- wherein:
- the pad portion comprises a first sub-pad unit comprising an inclined first pad and a second sub-pad unit comprising an inclined second pad;
- the first pad and the second pad are inclined in different directions symmetrically about an imaginary line that divides the pad portion;
- and
- the pad portion is electrically connected with the bump portion;
- the bump portion comprises a first sub-bump unit comprising an inclined first bump and a second sub-bump unit comprising an inclined second bump;
- the first bump and the second bump are inclined in different directions symmetrically about the imaginary line that divides the pad portion.
8 more elements
Dependencies are inferred from the claim text.