Dynamic resource management in circuit bound array architecture

A method, comprising:

• identifying a first memory operation for a first memory array die of a plurality of stacked die;
• identifying a second memory operation for a second memory array die of the plurality of stacked die;
• detecting that a first support circuitry die of the plurality of stacked die should be time shared by the first memory array die and the second memory array die;
• setting configurable electrical connections such that memory cells within the first memory array die are electrically connected to memory array support circuitry within the first support circuitry die;
• performing the first memory operation for the first memory array die while the memory cells within the first memory array die are electrically connected to the memory array support circuitry within the first support circuitry die;
• adjusting the configurable electrical connections such that memory cells within the second memory array die are electrically connected to the memory array support circuitry within the first support circuitry die;
• and
• performing the second memory operation for the second memory array die while the memory cells within the second memory array die are electrically connected to the memory array support circuitry within the first support circuitry die.