Method for joining a micorelectronic chip to a wire element
AssigneePrimo1D
InventorsDelphine Rolland, Christopher Mackanic, Gianfranco Andia Vera, Emmanuel Arene
Life of this patent
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Abstract
A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.
Claims20
A method of assembling a microelectronic chip on at least one wire element, comprising:
- applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary lateral groove;
- inserting the at least one wire element into the temporary groove;
- fixing the at least one wire element to the microelectronic chip;
- and
- removing the cover from the microelectronic chip.
Dependencies are inferred from the claim text.