Method for producing a stable sandwich arrangement of two components with solder situated therebetween

A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps of:

• (1) providing two components, each having at least one contact surface, and a free solder preform made of a solder metal, the solder metal being a tin-rich alloy having a tin content in a range of 90 to 99.5% by weight,
• (2) producing a sandwich arrangement of the components and a solder preform arranged between them and thus not yet connected to them, by bringing into contact (i) each one of the contact surfaces, (ii) each of the single contact surface of the components or (iii) one of the contact surfaces of one component and a single contact surface of the other component, with the contact surfaces of the free solder preform, and
• (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement, wherein
• the melting temperature of the solder metal of the free solder preform is in a range of 140 to 380° C. and the temperature during the hot-pressing is in a range of 84 to 342° C.,
• the free solder preform has an original thickness of 10 to 500 μm, and
• a combination of a pressing pressure in a range of 10 to 200 MPa and a pressing time in a range of 1 second to 5 minutes of the hot-pressing step (3) causes a reduction of the original thickness of the free solder preform by ≤10%.