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US 11,081,463 B2Granted
Bonding method with electron-stimulated desorption
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrank Fournel, Vincent Larrey, Sylvain Maitrejean, Christophe Morales
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Abstract
A method for directly bonding a first and a second substrate. The method comprises removing surface oxide layers from bonding faces of the first and of the second substrate, and hydrogen passivation of the bonding faces, then, in a vacuum, electron impact hydrogen desorption on the bonding faces followed by placement of the bonding faces in intimate contact with one another.
Claims10
A method for directly bonding a first substrate having a first bonding face and a second substrate having a second bonding face, comprising the steps of:
- removing a surface oxide layer from each of the first and second bonding faces;
- hydrogen passivating each of the first and second bonding faces;
- and
- in a vacuum, performing electron impact hydrogen desorption on the each of the first and second bonding faces followed by placing the first and second bonding faces in intimate contact with one another.
1 more element
Dependencies are inferred from the claim text.