Packaging process and packaging structure
AssigneeDelta Electronics Int'l (Singapore) Pte Ltd
InventorsChien-Ming Chen, Beng Beng Lim
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Abstract
A packaging process and a packaging structure of an electronic component are provided. By the packaging process and the packaging structure of the disclosure, the groove of the thermal conduction structure is covered by the first metal re-distribution layer. Therefore, the flank of the thermal conduction structure is easy to coat the conducting material. Moreover, because the flank of the thermal conduction structure is coated, the surface of the flank of the thermal conduction structure is difficulty oxidized. Furthermore, the conducting material between the thermal conduction structure and the board is flat, so that automated optical inspection of the packaging structure is easy to implement.
Claims15
A packaging process comprising steps of:
- (a) providing a semi-package unit comprising an electronic component, a thermal conduction structure, a first metal layer and a second metal layer embedded within an insulation structure, wherein the first metal layer is attached on the electronic component, the second metal layer is attached on the thermal conduction structure, wherein the second metal layer is not electrically connected with the electronic component;
- (b) removing a portion of the insulation structure to form at least one concave disposed on an edge of the semi-package unit, and removing a portion of insulation structure to form plural first openings on one side of the semi-package unit and expose the first metal layer and the second metal layer;
- (c) forming a first metal re-distribution layer to connect the insulation structure, the first metal layer and the second metal layer;
- and
- (d) forming plural second openings on the first metal re-distribution layer and forming a first mask on the second opening.
Dependencies are inferred from the claim text.