Methods and apparatuses for reflowing conductive elements of semiconductor devices
AssigneeMicron Technology, Inc.
InventorJames M. Derderian
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Abstract
Methods of reflowing electrically conductive elements on a wafer may involve directing a laser beam toward a region of a surface of a wafer supported on a film of a film frame to reflow at least one electrically conductive element on the surface of the wafer. In some embodiments, the wafer may be detached from a carrier substrate and be secured to the film frame before laser reflow. Apparatus for performing the methods, and methods of repairing previously reflowed conductive elements on a wafer are also disclosed.
Claims18
A method of reflowing electrically conductive elements on a wafer, comprising:
- transferring a wafer comprising a semiconductor material from a carrier substrate to a film supported by a film frame with a surface of the wafer bearing at least one conductive element facing away from the film;
- after placing the wafer on the film, directing a laser beam toward at least one region of a surface of the wafer;
- monitoring a surface temperature of at least a portion of the at least one region while directing the laser beam toward the at least one region;
- and
- reflowing at least one electrically conductive element on the surface of the wafer in the at least one region in response to applied energy from the laser beam.
A method of reflowing electrically conductive elements on a wafer, comprising:
- reflowing electrically conductive element on a surface of a wafer in a furnace while the wafer is supported by a carrier substrate;
- detaching the wafer from the carrier substrate;
- securing the wafer to a film comprising a polymer backing material and an adhesive material located between the polymer backing material and the wafer with the electrically conductive elements on the surface of the wafer facing away from the film;
- while the wafer is supported on the film, identifying defective, reflowed conductive elements,
- directing a laser beam toward the defective, reflowed conductive elements;
- and
- reflowing the defective, reflowed electrically conductive elements on the surface of the wafer a second time in response to applied energy from the laser beam.
Dependencies are inferred from the claim text.