Semiconductor package structure with antenna

A semiconductor package structure, comprising:

• a semiconductor die;
• a first redistribution layer (RDL) structure on a non-active surface of the semiconductor die;
• a second RDL structure on and electrically coupled to an active surface of the semiconductor die;
• a ground layer in the first RDL structure;
• a first molding compound layer on the first RDL structure;
• a plurality of patch antennas, wherein each of the plurality of patch antennas comprises:
• a first antenna element in the second RDL structure;
• and
• a second antenna element on the first molding compound layer;
• a metal isolation layer on the first molding compound layer to isolate the second antenna element of the plurality of patch antennas from each other;
• and
• a first through via structure in the first molding compound layer and electrically coupled between the ground layer and the metal isolation layer,
• wherein each of the first antenna element and the second antenna element has a first portion and a second portion adjoining the first portion, wherein each first portion overlaps the semiconductor die as viewed from a top-view perspective, wherein each of the first portions has a first edge and the first edges are aligned as viewed from the top-view perspective, and wherein each of the second portions has a second edge and the second edges are aligned as viewed from the top-view perspective.