Radiation shield around a component on a substrate
AssigneeIntel Corporation
InventorsDong-Ho Han, Jaejin Lee, Je-Young Chang, Jerrod Peterson, Mark Carbone
Life of this patent
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Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.
Claims20
An electronic device comprising:
- a substrate;
- a radiation source on the substrate;
- a ground on the substrate, wherein the ground is located around the radiation source;
- and
- a heat spreader over the radiation source, wherein the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate.
An electronic device comprising:
- a substrate;
- a radiation sensitive device on the substrate;
- a ground on the substrate, wherein the ground is located around the radiation sensitive device;
- and
- a heat spreader over the radiation sensitive device, wherein the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate.
A method comprising:
- creating a ground on a substrate around a radiation source on the substrate;
- adding one or more ground coupling mechanisms to a heat spreader;
- and
- coupling the heat spreader to the radiation source, wherein the one or more ground coupling mechanisms are in contact with the ground on the substrate.
Dependencies are inferred from the claim text.