Semiconductor device and method for manufacturing the same and wireless communication apparatus

A method for manufacturing a semiconductor device, comprising:

• mounting an electronic component on a wiring board;
• arranging a heat conduction member to contact the electronic component;
• and
• arranging a heat dissipation member to contact the heat conduction member,
• arranging the heat conduction member including
• arranging an electromagnetic wave absorption sheet,
• arranging a heat transfer sheet in which heat conductive particles are added to a resin, and
• arranging a heat conduction plate having a flat surface portion,
• in arranging the electromagnetic wave absorption sheet, the electromagnetic wave absorption sheet being arranged to cover the electronic component and to directly contact at least a side portion of the electronic component,
• in arranging the heat conduction plate, the heat conduction plate being arranged between the electromagnetic wave absorption sheet and the heat transfer sheet to directly contact the electromagnetic wave absorption sheet and the heat transfer sheet,
• in arranging the heat dissipation member, the heat conduction member being pressed by the heat dissipation member toward the electronic component.