Embedded die microelectronic device with molded component

An electronic system, comprising:

• a microelectronic device, comprising,
• a substrate defining multiple layers of conductive traces separated by respective layers of dielectric material,
• a molded component molded to a surface of the substrate, the molded component defining a planar outer surface independent of undulations of the surface of the substrate, and
• an embedded die at least partially within the substrate and at least partially underneath the molded component,
• multiple contacts extending though the molded component, including,
• a first group of vertical contacts extending though the molded component and arranged at a first pitch with respect to one another;
• and
• a second group of vertical contacts extending through the molded component and arranged at a second pitch with respect to one another, the second pitch smaller than the first pitch, wherein one or more vertical contacts of the second group of multiple contacts extend to electrically contact the embedded die, and
• first and second surface die coupled above the planar surface of the molded component, each of the first and second surface die electrically coupled through respective vertical contacts of the second group of vertical contacts to the embedded die, wherein at least one of the first and second die comprises a processor;
• and
• at least one of another microelectronic device, a mass storage device and a network interface operably coupled to the microelectronic device.