Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, the method comprising:

• (a) preparing a wiring substrate including a first main surface, a second main surface opposite the first main surface, a plurality of first terminals exposed on the first main surface, a plurality of second terminals exposed on the second main surface, a plurality of device regions of the first main surface mounting a plurality of semiconductor chips which is electrically connected with the plurality of first terminals, and a plurality of side surfaces connected to outer edges of each of the first main surface and the second main surface;
• and
• (b) sealing the plurality of semiconductor chips with a resin to form a sealing body,
• wherein the step (b) includes:
• (b1) preparing a first mold having a plurality of suction holes and a second mold having a cavity and being opposite the first mold;
• (b2) after the step (b1), disposing the wiring substrate between the first mold and the second mold, and holding the wiring substrate in the first mold such that the first main surface of the wiring substrate faces downward by suctioning the second main surface of the wiring substrate with the plurality of suction holes;
• (b3) after the step (b1), supplying the resin into the cavity of the second mold;
• (b4) after the step (b2) and the step (b3), forming the sealing body by setting a distance between the first mold and second mold such that the plurality of semiconductor chips, the first main surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate are respectively covered with the resin in the cavity;
• and
• (b5) forming the sealing body by curing the resin.