Package substrates with magnetic build-up layers
AssigneeIntel Corporation
InventorsZhiguo Qian, Kaladhar Radhakrishnan, Kemal Aygun
Life of this patent
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Abstract
The present disclosure is directed to systems and methods for improving the impedance matching of semiconductor package substrates by incorporating one or more magnetic build-up layers proximate relatively large diameter, relatively high capacitance, conductive pads formed on the lower surface of the semiconductor package substrate. The one or more magnetic layers may be formed using a magnetic build-up material deposited on the lower surface of the semiconductor package substrate. Vias conductively coupling the conductive pads to bump pads on the upper surface of the semiconductor package substrate pass through and are at least partially surrounded by the magnetic build-up material.
Claims16
A semiconductor interconnect, comprising:
- a substrate having a first surface and an opposite second surface;
- a magnetic build-up layer disposed proximate the first surface of the substrate;
- a plurality of bump pads disposed across a portion of the second surface of the substrate;
- a plurality of conductive ball pads disposed across a portion of the first surface of the substrate, each of the plurality of conductive ball pads disposed proximate the magnetic build-up layer;
- and
- a plurality of conductive vias, each of the plurality of conductive vias conductively coupling one of the plurality of bump pads to a respective one of the plurality of conductive ball pads, the magnetic build-up layer surrounding a portion of each of the plurality of conductive vias.
An electronic device, comprising:
- a substrate having a first surface and an opposite second surface;
- a magnetic build-up layer disposed proximate the first surface of the substrate;
- a plurality of bump pads disposed across a portion of the second surface of the substrate;
- a plurality of conductive ball pads disposed across a portion of the first surface of the substrate, each of the plurality of conductive ball pads disposed proximate the magnetic build-up layer;
- a plurality of conductive vias, each of the plurality of conductive vias conductively coupling one of the plurality of bump pads to a respective one of the plurality of conductive ball pads, the magnetic build-up layer surrounding a portion of each of the plurality of conductive vias;
- a die coupled to the plurality of bump pads disposed across the portion of the second surface of the substrate by a plurality of conductive bumps;
- and
- a system substrate coupled to the plurality of conductive ball pads disposed across a portion of the first surface of the substrate by a plurality of conductive balls.
Dependencies are inferred from the claim text.