Multi-die-package and method

A package enclosing a first power semiconductor die and a second power semiconductor die, the package comprising a package body with a package top side and a package footprint side, wherein:

• each of the first power semiconductor die and the second power semiconductor die has a respective front side and, opposite thereof, a respective back side;
• the first power semiconductor die has a first load terminal arranged at its front side and a second load terminal arranged at its back side;
• the second power semiconductor die has a first load terminal arranged at its front side and a second load terminal arranged at its back side;
• the package further comprises a lead frame structure configured to electrically and mechanically couple the package to a support with the package footprint side facing the support;
• and
• the lead frame structure comprises:
• a common base, wherein the second load terminal of the first power semiconductor die is electrically connected to the common base with its back side facing the common base, and wherein the first load terminal of the second power semiconductor die is electrically connected to the common base with its front side facing the common base;
• a common outside terminal extending out of the package body and being electrically connected with the common base;
• a first outside terminal extending out of the package body and being electrically connected with the first load terminal of the first power semiconductor die;
• and
• a second outside terminal extending out of the package body and being electrically connected with the second load terminal of the second power semiconductor die and electrically insulated from the first outside terminal, and
• wherein the common base comprises a conductive span that is disposed within the package and extends underneath both of the first and second semiconductor dies.