Electronic device with three dimensional thermal pad

An electronic device, comprising:

• a package structure, including a first side, a second side spaced apart from the first side along a first direction, a third side, a fourth side spaced apart from the third side along a second direction, a fifth side, and a sixth side spaced apart from the fifth side along a third direction, the first, second, and third directions being orthogonal to one another;
• a set of first leads, respective ones of the first leads extending outward from the first side along the first direction, wherein the first leads are gull wing leads, respective ones of the first leads including:
• a first portion extending outward from the first side along the first direction,
• a second portion extending from the first portion toward a plane of the fifth side and away from a plane of the fourth side, and
• a third portion extending from the second portion, and including a surface spaced apart from and beyond the plane of the fifth side;
• a set of second leads, respective ones of the second leads extending outward from the second side along the first direction, wherein the second leads are gull wing leads, respective ones of the second leads including:
• a first portion extending outward from the second side along the first direction,
• a second portion extending from the first portion toward the plane of the fifth side and away from the plane of the fourth side, and
• a third portion extending from the second portion, and including a surface spaced apart from and beyond the plane of the fifth side;
• and
• a thermal pad, including a first portion extending along a portion of the fifth side, and a second portion extending along a portion of the third side from an end of the first portion wherein the second portion of the thermal pad extends at a non-zero angle to the plane of the fifth side of the package structure, and wherein the non-zero angle is greater than 15 degrees and less than 90 degrees.

An electronic device, comprising:

• a package structure, including a first side, a second side spaced apart from the first side along a first direction, a third side, a fourth side spaced apart from the third side along a second direction, a fifth side, and a sixth side spaced apart from the fifth side along a third direction, the first, second, and third directions being orthogonal to one another;
• a set of first leads, respective ones of the first leads extending outward from the first side along the first direction, wherein the first leads are gull wing leads, respective ones of the first leads including:
• a first portion extending outward from the first side along the first direction,
• a second portion extending from the first portion toward a plane of the fifth side and away from a plane of the fourth side, and
• a third portion extending from the second portion, and including a surface spaced apart from and beyond the plane of the fifth side;
• a set of second leads, respective ones of the second leads extending outward from the second side along the first direction, wherein the second leads are gull wing leads, respective ones of the second leads including:
• a first portion extending outward from the second side along the first direction,
• a second portion extending from the first portion toward the plane of the fifth side and away from the plane of the fourth side, and
• a third portion extending from the second portion, and including a surface spaced apart from and beyond the plane of the fifth side;
• and
• a thermal pad, including a first portion extending along a portion of the fifth side, and a second portion extending along a portion of the third side from an end of the first portion wherein the third side of the package structure includes a beveled portion adjacent to the fifth side, wherein the beveled portion of the third side of the package structure extends at a non-zero angle to the plane of the fifth side, and wherein the second portion of the thermal pad extends along at least a portion of the beveled portion of the third side of the package structure.

An electronic device, comprising:

• a package structure, including a first side, a second side spaced apart from the first side along a first direction, a third side, a fourth side spaced apart from the third side along a second direction, a fifth side, and a sixth side spaced apart from the fifth side along a third direction, the first, second, and third directions being orthogonal to one another;
• a set of first leads, respective ones of the first leads extending outward from the first side along the first direction;
• a set of second leads, respective ones of the second leads extending outward from the second side along the first direction;
• and
• a thermal pad, including a first portion extending along a portion of the fifth side, and a second portion extending along a portion of the third side from an end of the first portion wherein the second portion of the thermal pad extends at a non-zero angle to a plane of the fifth side of the package structure, and wherein the non-zero angle is greater than 15 degrees and less than 90 degrees.

An electronic device, comprising:

• a package structure, including a first side, a second side spaced apart from the first side along a first direction, a third side, a fourth side spaced apart from the third side along a second direction, a fifth side, and a sixth side spaced apart from the fifth side along a third direction, the first, second, and third directions being orthogonal to one another;
• a set of first leads, respective ones of the first leads extending outward from the first side along the first direction;
• a set of second leads, respective ones of the second leads extending outward from the second side along the first direction;
• and
• a thermal pad, including a first portion extending along a portion of the fifth side, and a second portion extending along a portion of the third side from an end of the first portion wherein the third side of the package structure includes a beveled portion adjacent to the fifth side, wherein the beveled portion of the third side of the package structure extends at a non-zero angle to the plane of the fifth side, and wherein the second portion of the thermal pad extends along at least a portion of the beveled portion of the third side of the package structure.

A lead frame, comprising:

• a set of first leads, respective ones of the first leads extending along a first direction;
• a set of second leads spaced apart from the first leads along the first direction, respective ones of the second leads extending along the first direction;
• and
• a thermal pad spaced apart from the first leads and from the second leads, the thermal pad including:
• a first portion extending along a second direction, the second direction being orthogonal to the first direction, the first portion coplanar with the first and second leads in a plane of the first and second directions, and
• a second portion extending from an end of the first portion along a direction at a non-zero angle to the plane of the first and second directions.

A method, comprising:

• providing a lead frame, having:
• a set of first leads, respective ones of the first leads extending along a first direction,
• a set of second leads spaced apart from the first leads along the first direction, respective ones of the second leads extending along the first direction, and
• a thermal pad spaced apart from the first leads and from the second leads, the thermal pad including:
• a first portion extending along a second direction orthogonal to the first direction, the first portion coplanar with the first and second leads, and
• a second portion extending from an end of the first portion along a direction at a non-zero angle to a plane of the first and second directions, and
• a die attach pad coplanar with the first portion and with the first and second leads;
• attaching a semiconductor die to the die attach pad of the lead frame;
• attaching bond wires between respective bond pads of the semiconductor die and at least some of the first and second leads of the lead frame;
• and
• enclosing the semiconductor die, a portion of the die attach pad, portions of the first and second leads, and parts of the first and second portions of the thermal pad, in a package structure that exposes parts of the first and second portions of the thermal pad.