Self-healing PDMS encapsulation and repair of power modules
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorErcan Mehmet Dede
Life of this patent
Estimating the term…
Loading patent…
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorErcan Mehmet Dede
Estimating the term…
A power electronics assembly is provided with a self-healing feature. The power electronics assembly may include a semiconductor electronics device and an insulating substrate coupled to the semiconductor electronics device. A base metal structural component may be provided, coupled to the insulating substrate. The assembly may include a frame component cooperating with the base metal structural component and defining an enclosure containing the semiconductor electronics device and the insulating substrate. The assembly further includes a self-healing polymer comprising disulfide bonds. The self-healing polymer is disposed within the enclosure; additional potting material may also be provided as a multi-layered encapsulation. In various aspects, the self-healing polymer may include polydimethylsiloxane based polyurethane (PDMS-PU) modified with disulfide bonds. The frame component may be configured to direct or confine heat to areas of the assembly where ESD may be problematic.
A power electronics assembly with a self-healing feature, the power electronics assembly comprising:
A self-healing power module assembly with double sided cooling, the self-healing power module assembly comprising:
A power electronics assembly with a self-healing feature, the power electronics assembly comprising:
Dependencies are inferred from the claim text.