Substrate structure and semiconductor package structure

A semiconductor package structure, comprising:

• a package substrate having a first surface and a second surface opposite to the first surface;
• at least one semiconductor die electrically connected to the first surface of the package substrate;
• a heat dissipating device thermally connected to the first surface of the package substrate;
• at least one electronic device electrically connected to the second surface of the package substrate, wherein the electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate;
• and
• a heat transmitting structure disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device,
• wherein the package substrate has an inner area and an outer area surrounding the inner area, and includes a plurality of inner vias and plurality of outer vias, wherein the inner vias are disposed in the inner area, the outer vias are disposed in the outer area, and a pitch between the inner vias is greater than a pitch between the outer vias.

A semiconductor package structure, comprising:

• a package substrate having a first surface and a second surface opposite to the first surface;
• at least one semiconductor die electrically connected to the first surface of the package substrate;
• a heat dissipating device thermally connected to the first surface of the package substrate;
• at least one electronic device electrically connected to the second surface of the package substrate, wherein the electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate;
• and
• a heat transmitting structure disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device,
• wherein the heat dissipating device overlaps with a peripheral portion of the heat transmitting structure in a normal direction of the first surface and the second surface of the package substrate.