Back to results
US 11,081,416 B2Granted
Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsAbderrazzaq Ifis, Wolfgang Schrittwieser, Christian Vockenberger
Life of this patent
Estimating the term…
Abstract
A component carrier including a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a sealing structure sealing at least part of the component with regard to material of the stack, wherein the sealing structure is configured for reducing stress between the component and the stack.
Claims14
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- a component embedded in the stack;
- and
- a sealing structure sealing at least part of the component with regard to material of the stack, wherein the sealing structure is configured for reducing stress between the component and the stack;
- wherein a value of a coefficient of thermal expansion of the sealing structure is in between a value of the coefficient of thermal expansion of resin material of the at least one electrically insulating layer structure and a semiconductor material of the component.
2 more elements
A method of manufacturing a component carrier, the method comprising:
- embedding a component in a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- sealing at least part of the component with regard to material of the stack by a sealing structure;
- and
- configuring the sealing structure to reduce stress between the component and the stack;
- wherein a value of a coefficient of thermal expansion of the sealing structure is in between a value of the coefficient of thermal expansion of resin material of the at least one electrically insulating layer structure and a semiconductor material of the component.
2 more elements
Dependencies are inferred from the claim text.