Back to results
US 11,081,413 B2Granted
Semiconductor package with inner and outer cavities
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsin Lin Wu, Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang
Life of this patent
Estimating the term…
Abstract
A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.
Claims20
A semiconductor package structure, comprising:
- a substrate;
- a semiconductor die disposed on the substrate;
- a first frame disposed on the substrate;
- a first cap disposed on the first frame;
- a second frame disposed on the substrate;
- and
- a second cap disposed on the second frame and over the first cap,
- wherein the substrate, the first frame and the first cap define a first cavity in which the semiconductor die is disposed, and the substrate, the first frame, the first cap, the second frame and the second cap define a second cavity, wherein a pressure in the first cavity is different from a pressure in the second cavity.
5 more elements
Dependencies are inferred from the claim text.