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US 11,081,412 B2Granted
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsTakenori Yamada, Tomohiro Iguchi
Life of this patent
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Abstract
A semiconductor device of embodiments includes a first semiconductor chip; a metal plate having a first plane and a second plane facing the first plane and including a first ceramic plate provided between the first plane and the second plane; and a first insulating board provided between the first semiconductor chip and the metal plate and facing the first plane, in which the first ceramic plate does not exist between the first semiconductor chip and the second plane.
Claims18
A semiconductor device comprising:
- a first semiconductor chip;
- a metal plate having a first plane and a second plane facing the first plane, the metal plate including a first ceramic plate provided between the first plane and the second plane, and the metal plate including a second ceramic plate provided between the first plane and the second plane;
- and
- a first insulating board provided between the metal plate and the first semiconductor chip, the first insulating board facing the first plane,
- wherein the first ceramic plate does not exist between the first semiconductor chip and the second plane.
2 more elements
A semiconductor device comprising:
- a first semiconductor chip;
- a second semiconductor chip;
- a metal plate having a first plane and a second plane facing the first plane, the metal plate including a first ceramic plate provided between the first plane and the second plane;
- and
- a first insulating board provided between the metal plate and the first semiconductor chip, the first insulating board facing the first plane;
- and
- a second insulating board provided between the metal plate and the second semiconductor chip, the second insulating board facing the first plane,
- wherein the first ceramic plate does not exist between the first semiconductor chip and the second plane, and
- wherein the first ceramic plate does not exist between the second semiconductor chip and the second plane.
6 more elements
Dependencies are inferred from the claim text.