Semiconductor device and method for manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBwo-Ning Chen, Xu-Sheng Wu, Chang-Miao Liu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBwo-Ning Chen, Xu-Sheng Wu, Chang-Miao Liu
Estimating the term…
A method for manufacturing a semiconductor device, includes: forming a shallow trench isolation structure surrounding a first semiconductor fin and a second semiconductor fin; forming a dummy gate structure across the first and second semiconductor fins; forming a first flowable dielectric layer over the first and second semiconductor fins; curing the first flowable dielectric layer at a first temperature; removing a first portion of the cured first flowable dielectric layer from above the second semiconductor fin; after removing the first portion of the cured first flowable dielectric layer, forming a second flowable dielectric layer over the second semiconductor fin; curing the second flowable dielectric layer at a second temperature different from the first temperature; and replacing the dummy gate structure with a metal gate structure.
A method for manufacturing a semiconductor device, comprising:
A method for manufacturing a semiconductor device, comprising:
A method for manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.