Method for stabilizing a semiconductor arrangement

A method, comprising:

• producing a semiconductor arrangement having a semiconductor layer, a first insulation layer arranged on the semiconductor layer and facing a first surface of the semiconductor arrangement, and an insulating via extending in a vertical direction through the semiconductor layer as far as the first insulation layer, the insulating via surrounding a region of the semiconductor layer in a ring-shaped fashion;
• permanently securing a first carrier to the first surface of the semiconductor arrangement;
• before permanently securing the first carrier to the first surface of the semiconductor arrangement, securing a second carrier to a second surface of the semiconductor arrangement, the second surface facing away from the first surface;
• and
• after permanently securing the first carrier to the first surface of the semiconductor arrangement, removing the second carrier from the second surface.