Chip bonding device

A chip bonding apparatus, comprising:

• a chip separation unit;
• a chip alignment unit;
• a chip bonding unit;
• and
• a bonding robotic arm unit,
• wherein the bonding robotic arm unit comprises a first bonding robotic arm unit and a second bonding robotic arm unit;
• the first bonding robotic arm unit comprises a first motion stage, a first driver configured to drive the first motion stage, and at least one first bonding robotic arm which is arranged on the first motion stage and configured to suck up a chip from the chip separation unit and deliver the chip to the chip alignment unit;
• the second bonding robotic arm unit comprises a second motion stage, a second driver configured to drive the second motion stage, and at least one second bonding robotic arm which is arranged on the second motion stage and configured to suck up a chip from the chip alignment unit and deliver the chip to the chip bonding unit;
• wherein the chip alignment unit comprises a third motion stage and an alignment measurement system configured to measure a position of a mark on a chip;
• wherein the third motion stage at least comprises:
• a first part for receiving a chip delivered from the first bonding robotic arm;
• a second part for measuring, with the alignment measurement system, the position of the mark on the chip;
• and
• a third part for holding a chip which has been measured and is to be delivered by the second bonding robotic arm;
• wherein the first, second and third parts of the third motion stage are able to work simultaneously.