Method of dicing wiring substrate, and packaging substrate

A packaging substrate, comprising:

• a core substrate having at least one core surface on which an adhesive layer and a rim pattern are formed, the adhesive layer being provided with a laminate that has at least one wiring layer and at least one insulating layer, laminating, the rim pattern being provided with the insulating layer laminated thereon,
• the packaging substrate has outer surfaces in the width direction thereof, each comprising:
• an insulating side surface of the insulating layer;
• and
• a core step protruding in the width direction from the insulating side surface and including an end face of the core substrate, wherein each of the adhesive layer and the rim pattern is a film comprising Ti, Cr, Ni, Cu or an alloy thereof, or a metallic peroxide.

A packaging substrate, comprising:

• a core substrate having a first core surface and a second core surface, which is opposite to the first core surface, each of the first core surface and the second core surface having an adhesive layer and a rim pattern, the adhesive layer on each of the first core surface and the second core surface being provided with a laminate that has at least one wiring layer and at least one insulating layer, laminating, the rim pattern on each of the first core surface and the second core surface being provided with the insulating layer laminated thereon,
• the packaging substrate has outer surfaces in the width direction thereof, each comprising:
• an insulating side surface of the insulating layer on each of the first core surface and the second core surface;
• and
• a core step protruding in the width direction from the insulating side surface and including an end face of the core substrate.