MCM package isolation through leadframe design and package saw process
AssigneeTexas Instruments Incorporated
InventorsBernard Kaebin Andres Ancheta, Emerson Mamaril Enipin, John Carlo Cruz Molina
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Abstract
A method of making a semiconductor device includes mounting at least two semiconductor dies to a die pad of a leadframe in spaced apart relation to each other, the leadframe having a plurality of preformed leads, electrically connecting each semiconductor die to at least one preformed lead of the leadframe, forming a molding structure including at least part of the semiconductor dies and the preformed leads of the leadframe, and forming a trench in the molding structure in a space between the at least two semiconductor dies, the trench separating the die pad into first and second die pad portions.
Claims20
A semiconductor device, comprising:
- a leadframe having a die pad and a plurality of preformed leads;
- first and second semiconductor dies mounted to the die pad, each of the first and second semiconductor dies electrically connected to at least one preformed lead;
- a molding compound covering at least a portion of the leadframe and the first and second semiconductor dies;
- and
- a trench in a space between the first and second semiconductor dies separating the die pad into first and second die pad portions.
A packaged semiconductor device, comprising:
- a leadframe, including:
- a die pad with a first die pad portion and a second die pad portion, and
- a plurality of leads;
- a first semiconductor die mounted to the first die pad portion,
- a first bond wire that electrically connects the first semiconductor die to a first one of the plurality of leads;
- a second semiconductor die mounted to the second die pad portion, the second semiconductor die electrically connected to a second one of the plurality of leads;
- a second bond wire that electrically connects the second semiconductor die to a second one of the plurality of leads;
- and
- a trench that separates the first die pad portion and the second die pad portion.
A method of making a semiconductor device, comprising:
- providing a leadframe having a die pad and a plurality of preformed leads;
- mounting first and second semiconductor dies to the die pad, each of the first and second semiconductor dies electrically connected to at least one preformed lead;
- covering at least a portion of the leadframe and the first and second semiconductor dies with a molding compound;
- and
- separating the die pad into first and second die pad portions with a trench between the first and second semiconductor dies.
A method of making a packaged semiconductor device, comprising:
- providing a leadframe, including:
- a die pad with a first die pad portion and a second die pad portion, and
- a plurality of leads;
- mounting a first semiconductor die to the first die pad portion,
- electrically connecting the first semiconductor die to a first one of the plurality of leads with a first bond wire;
- mounting a second semiconductor die to the second die pad portion,
- electrically connecting the second semiconductor die to a second one of the plurality of leads with a second bond wire;
- and
- separating the first die pad portion and the second die pad portion with a trench.
Dependencies are inferred from the claim text.