Methods for polishing semiconductor substrates that adjust for pad-to-pad variance

A method for polishing semiconductor substrates, each substrate having a front surface and a back surface generally parallel to the front surface, the method comprising:

• contacting the front surface of a first semiconductor substrate with a polishing pad;
• supplying a first semiconductor substrate polishing slurry to the polishing pad to finish polish the front surface of the first semiconductor substrate and produce a polished first semiconductor substrate;
• measuring the edge roll-off of the first semiconductor substrate;
• contacting the front surface of a second semiconductor substrate with the polishing pad;
• supplying a second semiconductor substrate polishing slurry to the polishing pad to finish polish the front surface of the second semiconductor substrate;
• and
• controlling an amount of the second semiconductor substrate polishing slurry supplied to the polishing pad while contacting the second semiconductor substrate with the polishing pad based on, at least in part, the measured edge roll-off of the first semiconductor substrate.