Particle prevention in wafer edge trimming

A wafer trimming and cleaning apparatus, comprising:

• a blade configured to remove an outer edge portion of a wafer along a continuously connected trim path, wherein the trim path separates the outer edge portion of the wafer from an inner edge portion of the wafer, wherein removal of the outer edge portion by the blade defines a new sidewall of the wafer, and wherein the new sidewall of the wafer is based on the trim path;
• a wafer chuck configured to support the wafer;
• water nozzles having a first spray area configured to overlap and clean the new sidewall of the wafer at the blade;
• a solution nozzle having a second spray area configured to overlap and clean the inner edge portion of the wafer at the blade, wherein the second spray area borders the first spray area;
• and
• an air jet nozzle directed outward away from a center of the wafer chuck and having a third spray area configured to overlap the inner edge portion of the wafer at the blade, wherein the third spray area is larger than and includes the second spray area.

A wafer trimming and cleaning apparatus, comprising:

• a blade coupled to a blade apparatus and configured to trim an outer edge portion of a wafer to define a new sidewall of the wafer;
• water nozzles coupled to the blade apparatus and configured to apply deionized water to the new sidewall of the wafer to remove contaminant particles generated by the trimming and configured to apply deionized water to the blade to reduce a temperature of the blade;
• an air jet nozzle directed outward towards the blade apparatus and away from a center of the wafer, and configured to apply pressurized gas to a top surface of the wafer to remove the contaminant particles generated by the trimming;
• and
• a solution nozzle directed outward towards the blade apparatus and away from the center of the wafer and configured to apply a cleaning solution to the top surface of the wafer to remove the contaminant particles generated by the trimming.