Multi-layered ceramic electronic component and mounting board thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYun Tae Lee, Kyung Moon Jung, Han Kim
Life of this patent
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Abstract
A multilayer ceramic electronic component and a mounting board thereof include a reinforcing member that is disposed on upper and lower surfaces of a ceramic body of the multilayer ceramic electronic component and that is bonded to the first and the second external electrodes. The reinforcing member provides reduced occurrence of cracking and reduced stress applied to the component. The reinforcing member may have a coefficient of thermal expansion (CTE) that is within a range of 1 to 4 times a coefficient of thermal expansion of a dielectric layer of the ceramic body, and/or may have a modulus that is 0.5 or more times a modulus of the dielectric layer.
Claims19
A multilayer ceramic electronic component, comprising:
- a ceramic body including a dielectric layer and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other;
- a first external electrode and a second external electrode respectively disposed on the fifth surface and the sixth surface of the ceramic body;
- and
- a reinforcing member bonded to the first external electrode and the second external electrode and disposed on the first surface and the second surface,
- wherein a coefficient of thermal expansion (CTE) of the reinforcing member is within a range of 1 to 4 times a coefficient of thermal expansion of the dielectric layer.
A mounting board of a multilayer ceramic electronic component comprising:
- a printed circuit board having two or more electrode pads;
- a multilayer ceramic electronic component mounted on the printed circuit board;
- and
- a soldering connecting the electrode pads and the multilayer ceramic electronic component,
- wherein the multilayer ceramic electronic component comprises a ceramic body including a dielectric layer and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other;
- and a reinforcing member bonded to the first external electrode and the second external electrode and disposed on the first and second surfaces, and
- wherein a coefficient of thermal expansion (CTE) of the reinforcing member is within a range of 1 to 4 times a coefficient of the dielectric layer.
A multilayer ceramic capacitor comprising:
- a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes alternately stacked with dielectric layers therebetween;
- first and second external electrodes disposed on opposing surfaces of the ceramic body opposite each other in a stacking direction of the pluralities of first and second internal electrodes;
- and
- a reinforcing member disposed in a space between the first and second external electrodes on the opposing surfaces of the ceramic body opposite each other in the stacking direction,
- wherein a coefficient of thermal expansion (CTE) of the reinforcing member is within a range of 1 to 4 times a coefficient of thermal expansion of the dielectric layers.
Dependencies are inferred from the claim text.