Chip-shaped electronic component

A chip-shaped electronic component comprising:

• a substrate;
• and
• a termination electrode layer on an end face of the substrate,
• wherein the termination electrode layer is made of a mixed material that contains:
• an electrically-conductive substance (a′) containing carbon (a) as one type of the electrically-conductive substance (a′),
• whisker-like particles (b) covered with the electrically-conductive substance (a′),
• flake-like particles (c) having electroconductivity, and
• a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800, and
• a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1;
• wherein when the termination electrode layer is observed by cross-sectional scanning electron microscopy (SEM) at a magnification of 1000, the termination electrode layer includes a region in which a spacing between contact points of the whisker-like particles (b) exposed on an outermost surface of the termination electrode layer or the flake-like particles (c) exposed on the outermost surface of the termination electrode layer and an electroplated layer included in the chip-shaped electronic component is 10 μm or less seen in a 0.125 mm×0.034 mm randomly selected area of the termination electrode layer.

A chip-shaped electronic component comprising:

• a substrate;
• and
• a termination electrode layer on an end face of the substrate,
• wherein the termination electrode layer is made of a mixed material that contains:
• an electrically-conductive substance (a′) containing carbon (a) as one type of the electrically-conductive substance (a′),
• whisker-like particles (b) covered with the electrically-conductive substance (a′),
• flake-like particles (c) having electroconductivity, and
• a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800, and
• a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1;
• wherein a volume fraction of the whisker-like particles (b) and the flake-like particles (c) in the termination electrode layer is 7% or more and 25% or less.

A chip-shaped electronic component comprising:

• a substrate;
• and
• a termination electrode layer on an end face of the substrate,
• wherein the termination electrode layer is made of a mixed material that contains:
• an electrically-conductive substance (a′) containing carbon (a) as one type of the electrically-conductive substance (a′),
• whisker-like particles (b) covered with the electrically-conductive substance (a′),
• flake-like particles (c) having electroconductivity, and
• a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800, and
• a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1;
• wherein the termination electrode layer has a storage modulus of 107 Pa or more and 1010 Pa or less in a temperature range from −55° C. or more and 155° C. or less.