# US 11,079,548 B2 · Optical connection apparatus and optical connection method using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,079,548 B2 - Document ID: US11079548B2 - Status: Granted - Kind: B2 - Application number: 16/672,600 - Filed: 2019-11-04 - Published: 2020-09-17 - Granted: 2021-08-03 - Earliest claimed: 2019-03-12 - Assignees: Electronics and Telecommunications Research Institute - Applicants: Electronics and Telecommunications Research Institute - Inventors: Sun Hyok Chang; Joon Ki Lee - Web page: https://patentgrep.com/patent/US11079548B2 ## CPC - G02B 6/305: {and having an integrated mode-size expanding section, e.g. tapered waveguide} - G02B 6/32: having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} - G02B 6/34: utilising prism or grating {(G02B6/293 takes precedence)} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract An optical connection apparatus includes a position fixing portion configured to fix optical circuits each having a different end portion, while interposing a connection member that is optically imprintable between the optical circuits, and an optical-imprinting portion configured to emit light to the connection member to form a three-dimensional (3D) optical waveguide in the connection member that connects the optical circuits to each other. ## Claims ### Claim 1 An optical connection apparatus comprising: a position fixing portion configured to fix optical circuits having different end portions, while interposing a connection member that is optically imprintable between the optical circuits, wherein the optical circuits include an optical fiber and a photonic integrated circuit (PIC) chip; and an optical-imprinting portion configured to emit light to the connection member to form a three-dimensional (3D) optical waveguide in the connection member, which connects the optical fiber to the PIC chip. ### Claim 2 (depends on 1) The optical connection apparatus of claim 1, wherein the optical-imprinting portion adjusts both ends of the 3D optical waveguide to correspond to sizes and shapes of end portions of both a planar optical waveguide of the PIC chip and the optical fiber. ### Claim 3 (depends on 1) The optical connection apparatus of claim 1, wherein the optical-imprinting portion forms both ends of the 3D optical waveguide into tapered shapes to correspond to sizes and shapes of end portions of both a planar optical wave guide of the PIC chip and the optical fiber. ### Claim 4 (depends on 1) The optical connection apparatus of claim 1, wherein both ends of the 3D optical waveguide are connected with a mode converter formed of a grating coupler. ### Claim 5 (depends on 1) The optical connection apparatus of claim 1, wherein the optical-imprinting portion includes: a laser configured to emit light to a predetermined point of the connection member; a focusing lens through which the light emitted by the laser passes; and a position adjusting device configured to shift a position of the laser and the focusing lens. ### Claim 6 (depends on 5) The optical connection apparatus of claim 5, wherein the optical-imprinting portion further includes a controller configured to control driving of the laser and the position adjusting device, wherein the controller compares a predetermined reference value with a refractive index value of the connection member which varies when the connection member is being imprinted by the light passing through the focusing lens, and drives the position adjusting device based on the comparison. ### Claim 7 (depends on 1) The optical connection apparatus of claim 1, wherein the connection member includes at least one material selected from the group consisting of silica, a phosphate, a heavy metal oxide, a chalcogenide, and a halide such that the connection member has a refractive index varied by the light emitted by the optical-imprinting portion. ### Claim 8 (depends on 1) The optical connection apparatus of claim 1, wherein the connection member includes at least one material selected from the group consisting of lithium fluoride, lithium niobate, strontium barium niobate, and yttrium aluminum garnet such that the connection member has a refractive index varied by the light emitted by the optical-imprinting portion. ### Claim 9 An optical connection apparatus comprising: a position fixing portion configured to fix a plurality of optical circuits having end portions differing in size and shape, and to place at least one connection member that is optically imprintable on the plurality of optical circuits, wherein the plurality of optical circuits include one or more optical fibers and one or more photonic integrated circuit (PIC) chips; and an optical-imprinting portion configured to emit light to the connection member to form a three-dimensional (3D) optical waveguide in the connection member that connects the one or more optical fibers to the one or more PIC chips. ### Claim 10 (depends on 9) The optical connection apparatus of claim 9, wherein the optical-imprinting portion includes: a laser configured to emit light to a predetermined point of the connection member; a focusing lens through which the light emitted by the laser passes; and a position adjusting device configured to shift a position of the laser and the focusing lens. ### Claim 11 (depends on 10) The optical connection apparatus of claim 10, wherein the optical-imprinting portion further includes a controller configured to control driving of the laser and the position adjusting device, wherein the controller compares a predetermined reference value with a refractive index value of the connection member which varies when the connection member is being imprinted by the light passing through the focusing lens, and drives the position adjusting device based on the comparison. ### Claim 12 An optical connection method comprising: fixing positions of optical circuits having different end portions, while interposing a connection member that is optically imprintable between the optical circuits, wherein the optical circuits include an optical fiber and a photonic integrated circuit (PIC) chip; optically imprinting the connection member by emitting light to the connection member to form a three-dimensional (3D) optical waveguide in the connection member; and connecting both ends of the 3D optical waveguide to the optical fiber and the PIC chip. ### Claim 13 (depends on 12) The optical connection method of claim 12, wherein the optically imprinting includes forming the both ends of the 3D optical waveguide into tapered shapes to correspond to sizes and shapes of the end portions of the optical circuits.