# US 11,079,446 B2 · Compact sensor package

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,079,446 B2
- Document ID: US11079446B2
- Status: Granted
- Kind: B2
- Application number: 15/497,296
- Filed: 2017-04-26
- Published: 2017-11-02
- Granted: 2021-08-03
- Earliest claimed: 2016-04-27
- Assignees: Infineon Technologies AG
- Applicants: Infineon Technologies AG
- Inventors: Udo Ausserlechner; Michael Holliber
- Web page: https://patentgrep.com/patent/US11079446B2

## CPC

- G01R 33/0052: {Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85)}
- G01D 5/147: {influenced by the movement of a third element, the position of Hall device and the source of magnetic field being fixed in respect to each other}
- G01R 15/20: using galvano-magnetic devices, e.g. Hall-effect devices {, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices}
- G01R 19/0092: {Measuring current only}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR

## Abstract

Magnetic sensor arrangement comprising a component board delimited by two opposing main surfaces and having an accommodation hole for accommodating at least part of a magnetic field generating structure, and a magnetic sensor package located at least partially between the two opposing main surfaces and configured for sensing a magnetic field generated by the magnetic field generating structure.

## Claims

### Claim 1

A magnetic sensor arrangement, comprising:
a component board having a first vertical thickness and having an accommodation hole for accommodating at least part of a magnetic field generating structure;
a magnetic sensor package or a bare semiconductor chip having a second vertical thickness, mounted on the component board, and comprising a sensing element configured for sensing a magnetic field generated by the magnetic field generating structure;
wherein the sensing element is located vertically not more than one third of the sum of the first vertical thickness and the second vertical thickness away from a vertical center vertically in the middle between an upper end and a lower end of an assembly composed of the component board and the magnetic sensor package or the bare semiconductor chip mounted thereon.