# US 11,079,426 B2 · Test jig for testing electrical characteristics of semiconductor product

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,079,426 B2
- Document ID: US11079426B2
- Status: Granted
- Kind: B2
- Application number: 16/290,591
- Filed: 2019-03-01
- Published: 2020-03-12
- Granted: 2021-08-03
- Earliest claimed: 2018-09-10
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Daisuke Ikeda
- Web page: https://patentgrep.com/patent/US11079426B2

## CPC

- G01R 31/2601: {Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence)}
- G01R 1/0416: {Connectors, terminals (G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364)}
- G01R 31/2853: {Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections (G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66)}
- G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)}
- G01R 31/2865: {Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863)}
- G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.

## Claims

### Claim 1

A test jig for testing electrical characteristics of a semiconductor product, comprising:
a substrate having a first substrate electrode and a second substrate electrode formed for testing a semiconductor product having leads;
a conductive ground block configured to movably support the semiconductor product and/or the substrate;
lead pressers disposed so as to be movable to positions opposite to the first substrate electrode and the second substrate electrode on the substrate and configured to press the leads against the first substrate electrode and the second substrate electrode at the opposite positions, respectively, and the lead pressers each have a spring-supported pressing electrode changeable in position, wherein
electrical contact is established between the leads and the first and the second substrate electrodes to test electrical characteristics of the semiconductor product by moving to the opposite positions the ground block or the lead pressers to bring the leads into contact with the first substrate electrode and the second substrate electrode, respectively.

### Claim 2 (depends on 1)

The test jig for testing electrical characteristics of a semiconductor product, of claim 1, wherein the pressing electrode is a conductive pressing electrode changeable in position.

### Claim 3 (depends on 1)

The test jig for testing electrical characteristics of a semiconductor product, of claim 1, wherein the lead pressers each have a dielectric enclosure internally provided to the lead pressers, for covering the pressing electrodes.

### Claim 4 (depends on 2)

The test jig for testing electrical characteristics of a semiconductor product, of claim 2, wherein the ground block is provided movably in the thickness direction of the substrate, and the lead pressers each press a whole length from top to root of the leads in the longitudinal direction of the substrate, to test the electrical characteristics of the semiconductor product.

### Claim 5 (depends on 3)

The test jig for testing electrical characteristics of a semiconductor product, of claim 3, wherein the ground block is provided movably in the thickness direction of the substrate, and the lead pressers each press a whole length from top to root of the leads in the longitudinal direction of the substrate, to test the electrical characteristics of the semiconductor product.

### Claim 6 (depends on 4)

The test jig for testing electrical characteristics of a semiconductor product, of claim 4, wherein the lead pressers each have a dielectric enclosure internally provided to the lead pressers, for cover above and around the leads.

### Claim 7 (depends on 1)

The test jig for testing electrical characteristics of a semiconductor product, of claim 1, wherein the ground block is translationally movable in a thickness direction of the substrate, and the lead pressers are pivotally movable to the opposite positions or translationally movable in the thickness direction of the substrate.