# US 11,078,362 B2 · Polyamide composition containing a polyamide and an additive > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,078,362 B2 - Document ID: US11078362B2 - Status: Granted - Kind: B2 - Application number: 15/999,324 - Filed: 2017-02-16 - Published: 2019-03-07 - Granted: 2021-08-03 - Earliest claimed: 2016-02-19 - Assignees: BASF SE - Applicants: BASF SE - Inventors: Claus Gabriel; Simon Gramlich; Rainer Ostermann; Florian Richter; Raphael Dabbous; Thomas Meier; Wolfgang Schrof - Web page: https://patentgrep.com/patent/US11078362B2 ## CPC - C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) - B29C 64/153: using layers of powder being selectively joined, e.g. by selective laser sintering or melting - B33Y 70/00: Materials specially adapted for additive manufacturing - C08K 5/3465: condensed with carbocyclic rings - C08K 5/357: Six-membered rings - C08K 5/46: with oxygen or nitrogen in the ring - C08L 77/02: Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) - C09B 67/0097: {Dye preparations of special physical nature; Tablets, films, extrusion, microcapsules, sheets, pads, bags with dyes} - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C09B: ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES {, e.g. PIGMENTS}; MORDANTS; LAKES (fermentation or enzyme using processes to synthesise a desired chemical compound C12P) ## Abstract The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process. ## Claims ### Claim 1 A polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A), wherein the at least one additive (A) is selected from compounds of general formula (I) in which R1 and R3 are independently of one another selected from the group consisting of H, C1- to C10-alkyl and NR5R6, wherein R5 and R6 are independently of one another selected from the group consisting of H and C1- to C10-alkyl; R2 and R4 are independently of one another selected from the group consisting of H, C1- to C10-alkyl and NR7R8, wherein R7 and R8 are independently of one another selected from the group consisting of H and C1- to C10-alkyl; X represents N, O+ or S+; wherein the compounds of general formula (I) have a positive charge when X represents O+ or S+ and the compounds of general formula (I) then comprise an anion Y−, wherein Y− is selected from the group consisting of hydroxide, chloride, bromide, iodide, sulfate, sulfite, phosphate and phosphite, wherein the polyamide composition (PC) is present in the form of a powder having a particle size in the range from 1 to 200 μm, wherein the composition is a sintering powder; and wherein the polyamide composition (PC) comprises in the range from 95 to 99.9 wt % of the at least one polyamide (P) and in the range from 0.1 to 5 wt % of the at least one additive (A) in each case based on the sum of the weight percentages of the at least one polyamide (P) and of the at least one additive (A); wherein the polyamide composition has a D10 value in the range of from 10 to 30 μm. ### Claim 2 (depends on 1) The composition according to claim 1, wherein the at least one polyamide (P) present in the polyamide composition (PC) is selected from the group consisting of PA 4, PA 6, PA 7, PA 8, PA 9, PA 11, PA 12, PA 46, PA 66, PA 69, PA 510, PA 610, PA 612, PA 613, PA 1212, PA 1313, PA 6T, PA MXD6, PA 61, PA 6-3-T, PA 6/6T, PA 6/66, PA 66/6, PA 6/12, PA 66/6/610, PA 61/6T, PA PACM 12, PA 61/6T/PACM, PA 12/MACMI, PA 12/MACMT, PA PDA-T and copolyamides composed of two or more of the abovementioned polyamides. ### Claim 3 (depends on 1) The composition according to claim 1, wherein the at least one polyamide (P) present in the polyamide composition (PC) is selected from the group consisting of polyamide 6 (PA 6), polyamide 66 (PA 66), polyamide 6/66 (PA 6/66), polyamide 66/6 (PA 66/6), polyamide 610 (PA 610), polyamide 6/6T (PA 6/6T), polyamide 12 (PA12) and polyamide 1212 (PA1212). ### Claim 4 (depends on 1) The composition according to claim 1, wherein the substituents of the compounds of general formula (I) are defined as follows: R1 and R3 are independently of one another selected from the group consisting of H and C1- to C5-alkyl; R2 and R4 are independently of one another selected from the group consisting of C1- to C5-alkyl and NR7R8, wherein R7 and R8 are independently of one another selected from the group consisting of H and C1- to C5-alkyl; X is N or S+, wherein the compounds of general formula (I) have a positive charge when X represents S+ and the compounds of general formula (I) then comprise an anion Y−, wherein Y− is selected from the group consisting of hydroxide, chloride, bromide and iodide. ### Claim 5 (depends on 1) The composition according to claim 1, wherein the at least one additive (A) present in the polyamide composition (PC) is selected from the group consisting of neutral red and methylene blue. ### Claim 6 (depends on 1) The composition according to claim 1, wherein the polyamide composition (PC) comprises further additives (fA), wherein the further additives (fA) are selected from the group consisting of stabilizers, dyes, pigments, fillers, reinforcers, impact modifiers and plasticizers. ### Claim 7 (depends on 1) The composition according to claim 1, wherein the polyamide composition (PC) comprises in the range from 0.1 to 60 wt % of further additives (fA) based on the total weight of the polyamide composition (PC). ### Claim 8 (depends on 1) A method comprising selective laser sintering the polyamide composition (PC) according to claim 1. ### Claim 9 (depends on 1) A method comprising producing a molded article from the polyamide composition (PC) according to claim 1.