# US 11,078,361 B2 · Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

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- Number: US 11,078,361 B2
- Document ID: US11078361B2
- Status: Granted
- Kind: B2
- Application number: 16/332,259
- Filed: 2017-10-10
- Published: 2019-07-04
- Granted: 2021-08-03
- Earliest claimed: 2016-10-17
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Tatsuya Arisawa; Hirohisa Goto; Tomoyuki Abe
- Web page: https://patentgrep.com/patent/US11078361B2

## CPC

- B32B 5/26: another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)}
- C08L 71/126: {modified by chemical after-treatment}
- B32B 5/022: {Non-woven fabric}
- B32B 15/08: of synthetic resin
- B32B 15/14: next to a fibrous or filamentary layer
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/00: Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)}
- C08F 290/062: {Polyethers}
- C08G 59/063: {with epihalohydrins}
- C08G 59/4014: {Nitrogen containing compounds}
- C08G 59/686: {containing nitrogen}
- C08G 65/3322: {acyclic}
- C08J 5/10: characterised by the additives used in the polymer mixture
- C08J 5/244: {using glass fibres}
- C08J 5/249: {characterised by the additives used in the prepolymer mixture}
- C08K 5/34924: {containing cyanurate groups; Tautomers thereof}
- C08K 5/49: Phosphorus-containing compounds {(C08K5/0091 takes precedence)}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L 63/04: Epoxynovolacs
- C08L 101/00: Compositions of unspecified macromolecular compounds
- H05K 1/03: Use of materials for the substrate
- H05K 1/0353: {consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- B32B 2255/26: Polymeric coating
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/028: Paper layer
- B32B 2260/046: Synthetic resin
- B32B 2262/0269: Aromatic polyamide fibres
- B32B 2262/0276: Polyester fibres
- B32B 2262/101: Glass fibres
- B32B 2307/204: Di-electric
- B32B 2307/206: Insulating
- B32B 2307/306: Resistant to heat
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- B32B 2307/714: Inert, i.e. inert to chemical degradation, corrosion
- B32B 2307/748: Releasability
- B32B 2363/00: Epoxy resins
- B32B 2371/00: Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
- B32B 2457/08: PCBs, i.e. printed circuit boards
- C08J 2371/12: Polyphenylene oxides
- C08J 2463/00: Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08K 5/0066: {Flame-proofing or flame-retarding additives}
- C08K 5/5313: Phosphinic compounds, e.g. R2=P(:O)OR'
- C08K 5/5399: Phosphorus bound to nitrogen
- C08L 2201/02: Flame or fire retardant/resistant
- H05K 2201/012: Flame-retardant; Preventing of inflammation
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.

## Claims

### Claim 1

A resin composition comprising:
a thermosetting resin;
a curing agent that reacts with the thermosetting resin;
silica; and
a flame retardant,
wherein
the thermosetting resin contains a modified polyphenylene ether compound which is terminal-modified with a substituent having a carbon-carbon unsaturated double bond,
the curing agent contains at least one kind selected from the group consisting of a trialkenyl isocyanurate compound and a polyfunctional vinyl compound having two or more vinyl groups in a molecule,
the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture,
the compatible phosphorus compound contains at least one kind selected from the group consisting of a phosphoric acid ester compound and a phosphazene compound,
the non-compatible phosphorus compound contains at least one kind selected from the group consisting of a phosphinate compound and a diphenylphosphine oxide compound,
a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent,
a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent,
a content ratio of the compatible phosphorus compound and the non-compatible phosphorus compound is 3:97 to 19:81 in mass ratio, and
a content of the modified polyphenylene ether compound is 30 to 90 parts by mass per 100 parts by mass of the total of the modified polyphenylene ether compound and the curing agent.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein
the compatible phosphorus compound contains a phosphazene compound, and
the non-compatible phosphorus compound contains a phosphinate compound.

### Claim 3 (depends on 1)

The resin composition according to claim 1, wherein the curing agent has a weight average molecular weight of 100 to 5000 and an average of 1 to 20 carbon-carbon unsaturated double bonds in one molecule.

### Claim 4 (depends on 1)

The resin composition according to claim 1, wherein the modified polyphenylene ether compound has a weight average molecular weight of 500 to 5000 and an average of 1 to 5 substituents in one molecule.

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the substituent at the terminal of the modified polyphenylene ether compound contains a substituent having at least one kind selected from the group consisting of a vinylbenzyl group, an acrylate group, and a methacrylate group.

### Claim 6 (depends on 1)

A method for producing the resin composition according to claim 1, comprising the:
mixing the thermosetting resin, the curing agent, and the flame retardant.

### Claim 7 (depends on 1)

A prepreg comprising the resin composition according to claim 1 or a semi-cured product of the resin composition and a fibrous base material.

### Claim 8 (depends on 1)

A film with a resin, comprising a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition, and a support film.

### Claim 9 (depends on 1)

A metal foil with a resin, comprising a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition, and a metal foil.

### Claim 10 (depends on 1)

A metal-clad laminate comprising an insulating layer containing a cured product of the resin composition according to claim 1, and a metal foil.

### Claim 11 (depends on 1)

A wiring board comprising an insulating layer containing a cured product of the resin composition according to claim 1, and a wiring.

### Claim 12 (depends on 11)

The wiring board according to claim 11, wherein
the wiring board has a plurality of the insulating layers, and
the wiring is disposed between the insulating layers.