# US 11,078,358 B2 · Curable composition including epoxy resin and curable solid filler > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,078,358 B2 - Document ID: US11078358B2 - Status: Granted - Kind: B2 - Application number: 16/494,976 - Filed: 2018-07-25 - Published: 2020-05-14 - Granted: 2021-08-03 - Earliest claimed: 2017-07-31 - Assignees: 3M Innovative Properties Company - Applicants: 3M Innovative Properties Company - Inventors: Lianzhou Chen; Kristen J. Hansen - Web page: https://patentgrep.com/patent/US11078358B2 ## CPC - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08G 59/245: {aromatic} - C08G 59/3227: {Compounds containing acyclic nitrogen atoms} - C08G 59/38: together with di-epoxy compounds - C08G 59/44: Amides - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators} - C08K 5/17: Amines; Quaternary ammonium compounds - C08K 7/02: Fibres or whiskers - C08K 2201/005: Additives being defined by their particle size in general - C08K 2201/011: Nanostructured additives - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same. ## Claims ### Claim 1 A curable composition comprising: a liquid epoxy resin component; a curative component; and a curable resin filler component, at least a portion of which is dispersed in the liquid epoxy resin and having a melting point in the range of from 50° C. to 250° C., wherein both the curable resin filler and curative component remain solid within the curable composition at 25° C. such that a film comprising the curable composition is tacky and is capable of being cut and applied to a substrate. ### Claim 2 (depends on 1) The curable composition according to claim 1, wherein the liquid epoxy resin component comprises one or more epoxy resins chosen from a diglycidyl ether of bisphenol F, a low epoxy equivalent weight diglycidyl ether of bisphenol A, a liquid epoxy novolac, a liquid aliphatic epoxy, a liquid cycloaliphatic epoxy, a 1,4-cyclohexandimethanoldiglycidylether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, tetraglycidylmethylenedianiline, N,N,N′,N′-tetraglycidyl-4,4′ methylenebisbenzenamine, a triglycidyl of para-aminophenol, N,N,N′,N′-tetraglycidyl-m-xylenediamine, and a mixture thereof. ### Claim 3 (depends on 1) The curable composition according to claim 1, wherein the curable resin filler component is in the range of from about 2 wt % to about 70 wt % of the curable composition. ### Claim 4 (depends on 1) The curable composition according to claim 1, wherein the curable resin filler component comprises one or more resins chosen from a solid epoxy resin, a bismaleimide resin, a polyimide resin, a cyanate ester resin, a benzoxazine resin, and a mixture thereof. ### Claim 5 (depends on 1) The curable composition according to claim 1, further comprising a thermoplastic polymer filler component. ### Claim 6 (depends on 5) The curable composition of claim 5, wherein the thermoplastic polymer filler component is in the range of from about 5 wt % to about 80 wt % of the curable composition. ### Claim 7 (depends on 5) The curable composition according to claim 5, wherein the thermoplastic polymer filler component comprises one or more thermoplastic polymers chosen from an acrylate, an alkyl(meth) acrylate, a polyamide-imide, a polyetherimide, a polysulfone, a polyamide, a polyvinylchloride, an acrylonitrile butadiene styrene, a polystyrene, a polyether ether ketone, a polyetherketoneketone, a polytetrafluoroethylene, a polyphenylene sulphide, a polyethylene terephthalate, a polyoxymethylene, a polypropylene, a high density polyethylene, a low density polyethylene, a polypropylene, a siloxane, a polyoxymethylene, a polycarbonate, a polyarylsulfone, a polyethersulfone, a polyphenlysulfone, and a mixture thereof. ### Claim 8 (depends on 7) The curable composition according to claim 7, wherein a weight average molecular weight of at least one of the thermoplastic polymers is in the range of from about 5,000 daltons to about 100,000 daltons. ### Claim 9 (depends on 5) The curable composition of claim 5, wherein about 50 wt % to about 100 wt % of the one or more thermoplastic polymers are solid in the curable composition at a temperature of 25° C. ### Claim 10 (depends on 1) The curable composition according to claim 1, wherein the curative component comprises one or more curative compounds chosen from an aliphatic polyamine compound, an aromatic polyamine compound, an aromatic polyamide compound, an alicyclic polyamine compound, a polyamine compound, a polyamide compound, an amino resin compound, a 9,9-bis(aminophenyl)fluorene compound, and a mixture thereof. ### Claim 11 (depends on 1) The curable composition according to claim 1, further comprising core-shell rubber nanoparticles. ### Claim 12 (depends on 11) The curable composition according to claim 11, wherein the curable composition comprises: about 15 wt % to about 55 wt % of the liquid epoxy resin component; about 10 wt % to about 53 wt % of the curative component; about 15 wt % to about 25 wt % of the curable resin filler component; about 15 wt % to about 25 wt % thermoplastic filler component; and about 2 wt % to about 30 wt % of the core-shell rubber nanoparticles. ### Claim 13 (depends on 1) A method of making the curable composition according to claim 1, the method comprising: adding the curative component to a first solution comprising the liquid epoxy resin component and the curable resin filler component to form a second solution; and forming the curable composition. ### Claim 14 (depends on 13) The method of claim 13, further comprising mixing the first solution. ### Claim 15 (depends on 13) The method according to claim 13, further comprising mixing the second solution. ### Claim 16 (depends on 13) The method according to claim 13, further comprising adding the thermoplastic resin to the second solution. ### Claim 17 (depends on 1) A cured product of the curable composition according to claim 1. ### Claim 18 (depends on 17) The cured product according to claim 17, wherein a Wet Glass Transition Temperature and a Dry Glass Transition Temperature of the cured product are substantially equal. ### Claim 19 (depends on 18) The cured product according to claim 18, wherein the Wet Glass Transition Temperature and the Dry Glass Transition Temperature of the cured product independently is in the range of from about 100° C. to about 300° C. ### Claim 20 (depends on 1) The curable composition according to claim 1, wherein the tacky film product has a thickness range of 0.1 mm to 1.20 mm. ### Claim 21 (depends on 20) The curable composition according to claim 20, wherein the tacky film product has a thickness range from 2 mm to 15 mm.