# US 11,077,608 B2 · Enhancing adhesion of objects to carriers during additive manufacturing

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- Number: US 11,077,608 B2
- Document ID: US11077608B2
- Status: Granted
- Kind: B2
- Application number: 16/963,599
- Filed: 2019-02-21
- Published: 2021-01-14
- Granted: 2021-08-03
- Earliest claimed: 2018-02-21
- Assignees: Carbon, Inc.
- Applicants: Carbon, Inc.
- Inventors: Bob E. Feller; Kyle Laaker
- Web page: https://patentgrep.com/patent/US11077608B2

## CPC

- B29C 64/124: using layers of liquid which are selectively solidified
- B29C 64/129: characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C 64/188: involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00)
- B29C 64/245: Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40)
- B29C 64/264: Arrangements for irradiation
- B29C 64/35: Cleaning
- B29C 64/393: for controlling or regulating additive manufacturing processes
- B33Y 10/00: Processes of additive manufacturing
- B33Y 40/20: Post-treatment, e.g. curing, coating or polishing
- B33Y 50/02: for controlling or regulating additive manufacturing processes
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

## Abstract

A method of making a three-dimensional object from a light polymerizable resin, includes the steps of: (a) producing an object adhered to a carrier plate by light polymerization of the resin in a bottom-up stereolithography process (e.g., continuous liquid interface production); (i) the object including a carrier plate adhesion portion, a main body portion, and a circumferential boundary portion included in the carrier plate adhesion portion and optionally extending into at least part of the main body portion; (ii) the stereolithography process including overexposing the boundary portion (as compared to the exposure of the adhesion portion or main body portion) with light; (b) optionally cleaning the object; and then (c) optionally baking the object to produce a further cured three-dimensional object.

## Claims

### Claim 1

A method of making a three-dimensional object from a light polymerizable resin, comprising the steps of:
(a) producing an object adhered to a carrier plate by light polymerization of said resin in a bottom-up stereolithography process;
(i) said object comprising a carrier plate adhesion portion, a main body portion, and a circumferential boundary portion included in said carrier plate adhesion portion;
(ii) said stereolithography process including overexposing said boundary portion, as compared to the exposure of said adhesion portion or main body portion, with light to enhance adhesion of said object to said carrier plate during the bottom-up stereolithography process;
(b) optionally cleaning said object; and then
(c) optionally baking said object to produce a further cured three-dimensional object, wherein said circumferential boundary portion either (i) extends into only a part of said main body portion or (ii) does not extend into said main body portion.

### Claim 2 (depends on 1)

The method of claim 1, wherein said resin comprises a dual cure resin, and said cleaning step (b) and said baking step (c) are included.

### Claim 3 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion is interrupted or perforated.

### Claim 4 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion is uninterrupted.

### Claim 5 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion comprises a surface edge portion.

### Claim 6 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion comprises an internal boundary portion.

### Claim 7 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion comprises a combination of at least one surface edge portion and at least one internal boundary portion.

### Claim 8 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion is feathered in the Z dimension.

### Claim 9 (depends on 1)

The method of claim 1, wherein said cleaning step is carried out by wiping including blowing, washing, or a combination thereof.

### Claim 10 (depends on 1)

The method of claim 1, wherein said carrier plate adhesion portion has a surface area adhered to said carrier plate of from 1 to 400 square centimeters.

### Claim 11 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion has an average width (in the X-Y dimension) of from 0.1 to 20 millimeters.

### Claim 12 (depends on 1)

The method of claim 1, wherein said carrier plate adhesion portion includes symbols and/or designs directly facing and/or contacting said carrier plate.

### Claim 13 (depends on 1)

The method of claim 1, wherein said object main body portion comprises a lattice.

### Claim 14 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion extends into only a part of said main body portion.

### Claim 15 (depends on 1)

The method of claim 1, wherein said circumferential boundary portion does not extend into said main body portion.

### Claim 16 (depends on 1)

The method of claim 1, wherein said bottom-up stereolithography process is carried out using continuous liquid interface production (CLIP).
