# US 11,077,536 B2 · Slurry distribution device for chemical mechanical polishing

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- Number: US 11,077,536 B2
- Document ID: US11077536B2
- Status: Granted
- Kind: B2
- Application number: 15/626,936
- Filed: 2017-06-19
- Published: 2017-12-28
- Granted: 2021-08-03
- Earliest claimed: 2016-06-24
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Yen-Chu Yang; Stephen Jew; Jianshe Tang; Haosheng Wu; Shou-Sung Chang; Paul D. Butterfield; Alexander John Fisher; Bum Jick Kim
- Web page: https://patentgrep.com/patent/US11077536B2

## CPC

- B24B 57/02: for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
- B24B 37/10: for single side lapping
- H10P 72/0422: {for wet etching}
- H10P 72/0424: {using mainly spraying means, e.g. nozzles}
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

## Claims

### Claim 1

An apparatus for chemical mechanical polishing, comprising:
a rotatable platen having a surface to support a polishing pad;
a carrier head to hold a substrate in contact with the polishing pad;
a polishing liquid distribution system, the polishing liquid distribution system including
a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and
a first barrier spaced apart from the dispenser and positioned over the polishing surface before the portion of the polishing surface where the dispenser is to deliver the polishing liquid and configured to block used polishing liquid being carried on the polishing surface from reaching the portion of the polishing surface, wherein the first barrier includes a solid body having a portion with a leading surface to contact the used polishing liquid, wherein the portion of the first barrier that contacts the used polishing liquid curves about an axis perpendicular to the polishing surface.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the platen is configured to rotate to provide a direction of motion below the first barrier, and the first leading surface of the first barrier is curved such that such that a concave side of the first leading surface of the first barrier faces in the direction of motion.

### Claim 3 (depends on 1)

The apparatus of claim 1, comprising a second barrier spaced apart from the dispenser and positioned over the polishing surface after the portion of the polishing surface where the dispenser is to deliver the polishing liquid and configured to spread fresh polishing liquid on the polishing surface delivered by the dispenser to the portion of the polishing surface, wherein a second leading surface of the second barrier curves about an axis perpendicular to the polishing surface.

### Claim 4 (depends on 3)

The apparatus of claim 3, wherein the platen is configured to rotate to provide a direction of motion below the first barrier and the second barrier, the first leading surface of the first barrier is curved such that such that a concave side of the first leading surface of the first barrier faces in the direction of motion, and the second leading surface of the second barrier is curved such that such that a concave side of the second leading surface of the second barrier faces in the direction of motion.

### Claim 5 (depends on 3)

The apparatus of claim 3, wherein a radius of curvature of the second leading surface is less than a radius of curvature of the first leading surface.

### Claim 6 (depends on 3)

The apparatus of claim 3, comprising a first actuator configured to adjust a height of the first barrier relative to the polishing surface and/or a pressure of the first barrier on the polishing surface, and/or a second actuator configured to independently adjust a height of the second barrier relative to the polishing surface and/or a pressure of the second barrier on the polishing surface.

### Claim 7 (depends on 1)

The apparatus of claim 1, comprising a first actuator configured to adjust a height of the first barrier relative to and/or a pressure of the first barrier on the polishing surface.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the solid body has a flat bottom surface.