# US 11,076,838 B2 · Ultrasonic endoscope > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,076,838 B2 - Document ID: US11076838B2 - Status: Granted - Kind: B2 - Application number: 16/205,369 - Filed: 2018-11-30 - Published: 2019-04-04 - Granted: 2021-08-03 - Earliest claimed: 2016-06-30 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Yasuhiko Morimoto; Katsuya Yamamoto; Satoru Okada - Web page: https://patentgrep.com/patent/US11076838B2 ## CPC - A61B 8/546: {involving monitoring or regulation of device temperature} - A61B 8/12: in body cavities or body tracts, e.g. by using catheters - A61B 8/44: {Constructional features of the ultrasonic, sonic or infrasonic diagnostic device} - A61B 8/4444: {related to the probe} - A61B 8/445: {Details of catheter construction} - A61B 8/4483: {characterised by features of the ultrasound transducer} - A61B 8/4488: {the transducer being a phased array} - B06B 1/0622: {on one surface} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) ## Abstract An ultrasonic endoscope has an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged; a backing material layer on a back side of a plurality of ultrasonic transducers, a wiring board including a plurality of electrode pads that are connected to the plurality of ultrasonic transducers; a plurality of shield cables each including a signal wire and a shield member, a wiring portion in which the plurality of signal wires are electrically connected to the plurality of electrode pads; a ground portion that is electrically connected to the shield members and that have heat conductivity; and a first heat conductive member that extends beyond the backing material layer to a side opposite to the ultrasonic transducer array with respect to the backing material layer and that is thermally connected to the ground portion. ## Claims ### Claim 1 An ultrasonic endoscope comprising: a laminated body that comprises an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged, and a backing material layer that is disposed on a back surface side of the plurality of ultrasonic transducers: a wiring board that comprises a plurality of electrode pads each of which is electrically connected to a corresponding one of the plurality of ultrasonic transducers of the ultrasonic transducer array; a plurality of shield cables that comprise a plurality of signal wires each of which is electrically connected to a corresponding one of the plurality of ultrasonic transducers, and shield members for the plurality of signal wires; a wiring portion that comprises a plurality of connection portions at each which a corresponding one of the plurality of signal wires of the plurality of shield cables is electrically connected to a corresponding one of the plurality of electrode pads of the wiring board; a ground portion that is electrically connected to the shield members of the shield cables and that has heat conductivity; and a first heat conductive member that is disposed on a side surface of the laminated body that comprises the ultrasonic transducer array and the backing material layer, that extends beyond the backing material layer to a side opposite to the ultrasonic transducer array with respect to the backing material layer, and that is thermally connected to the ground portion, wherein the first heat conductive member is an electroconductive member, wherein the wiring board Is disposed on the laminated body side with respect to the first heat conductive member, wherein, in a region in which the first heat conductive member covers at least the plurality of connection portions of use wiring portion of the wiring board, the ultrasonic endoscope has an insulating layer between the first heat conductive member and the plurality of connection portions, wherein the insulating layer is formed so as to be affixed along the side surface of the laminated body that comprises the ultrasonic transducer array and the backing material layer and extend beyond the backing material layer to a side opposite to the ultrasonic transducer array with respect to the backing material layer. ### Claim 2 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the first heat conductive member is folded back toward the side surface side of the laminated body and is connected to the ground portion. ### Claim 3 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the insulating layer is removed at least at a portion where the first heat conductive member is connected to the ground portion. ### Claim 4 (depends on 2) The ultrasonic endoscope according to claim 2, wherein the insulating layer is removed at least at a portion where the first heat conductive member is connected to the ground portion. ### Claim 5 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the first heat conductive member has, in a portion extending beyond the backing material layer to the side opposite to the ultrasonic transducer array with respect to the backing material layer, a shape that covers at least a part of a side surface of the wiring board. ### Claim 6 (depends on 2) The ultrasonic endoscope according to claim 2, wherein the first heat conductive member has, in a portion extending beyond the backing material layer to the side opposite to the ultrasonic transducer array with respect to the backing material layer, a shape that covers at least a part of a side surface of the wiring board. ### Claim 7 (depends on 3) The ultrasonic endoscope according to claim 3, wherein the first heat conductive member has, in a portion extending beyond the backing material layer to the side opposite to the ultrasonic transducer array with respect to the backing material layer, a shape that covers at least a part of a side surface of the wiring board. ### Claim 8 (depends on 4) The ultrasonic endoscope according to claim 4, wherein the first heat conductive member has, in a portion extending beyond the backing material layer to the side opposite to the ultrasonic transducer array with respect to the backing material layer, a shape that covers at least a part of a side surface of the wiring board. ### Claim 9 (depends on 1) The ultrasonic endoscope according to claim 1, wherein, in a portion extending beyond the backing material layer to the side opposite to the ultrasonic transducer array with respect to the backing material layer, the first heat conductive member is bent so as to surround the wiring portion and the ground portion and is connected to the ground portion. ### Claim 10 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the first heat conductive member is an electroconductive member, and wherein the first heat conductive member and the ground portion are connected to each other by using a solder or a silver paste. ### Claim 11 (depends on 1) The ultrasonic endoscope according to claim 1, wherein a plurality of the wiring boards are disposed in a portion that is beyond the backing material layer on the side opposite to the ultrasonic transducer array with respect to the backing material layer. ### Claim 12 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the shield members of the plurality of shield cables are made of a metal, and wherein the ground portion is a collective ground portion to which the shield members of the plurality of shield cables are electrically connected, a ground bar that is provided in the wiring portion and to which the shield members are electrically connected, or a ground pad that is provided in the wiring board and that is electrically connected to the ground bar. ### Claim 13 (depends on 12) The ultrasonic endoscope according to claim 12, wherein a melting point of a solder that is used to connect the first heat conductive member to the collective ground portion, the ground bar, or the ground pad is lower than a melting point of a solder that is used to connect the collective ground portion, the ground bar, or the ground pad to the shield members of the plurality of coaxial cables. ### Claim 14 (depends on 12) The ultrasonic endoscope according to claim 12, wherein the ground bar or the ground pad is provided on at least one of a front surface of the wiring board that is a surface on the first heat conductive member side, a back surface of the wiring board that is on a back side of the front surface, or both end surfaces of the front surface and the back surface of the wiring board, and wherein the first heat conductive member is connected to the ground bar or the ground pad. ### Claim 15 (depends on 12) The ultrasonic endoscope according to claim 12, wherein a plurality of the wiring boards are disposed in a portion that is beyond the backing material layer on the side opposite to the ultrasonic transducer array with respect to the backing material layer, and wherein, among the plurality of wiring boards, the ground bars or the ground pads of the wiring boards that are disposed adjacent to each other are thermally connected by using a second heat conductive member that is independent from the first heat conductive member. ### Claim 16 (depends on 12) The ultrasonic endoscope according to claim 12, wherein a plurality of the wiring boards are disposed in a portion that is beyond the backing material layer on the side opposite to the ultrasonic transducer array with respect to the backing material layer, wherein at least one of the wiring boards on a central side connects the first heat conductive member to the ground bar or the ground pad on the central side or an end surface side of the wiring board, and wherein at least one of the wiring boards on an outer side connects the first heat conductive member to the ground bar or the ground pad on the outer side or on an end surface side of the wiring board. ### Claim 17 (depends on 16) The ultrasonic endoscope according to claim 16, wherein, among the plurality of wiring boards, the ground bars or the ground pads of the wiring boards that are disposed adjacent to each other are thermally connected by using a second heat conductive member that is independent from the first heat conductive member. ### Claim 18 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the first heat conductive member is composed of two first heat conductive members that are disposed on both side surfaces of the laminated body and that are connected to each other by using a third heat conductive member.