# US 11,076,837 B2 · Ultrasonic endoscope > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,076,837 B2 - Document ID: US11076837B2 - Status: Granted - Kind: B2 - Application number: 16/197,816 - Filed: 2018-11-21 - Published: 2019-03-28 - Granted: 2021-08-03 - Earliest claimed: 2016-06-30 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Katsuya Yamamoto; Yasuhiko Morimoto; Satoru Okada - Web page: https://patentgrep.com/patent/US11076837B2 ## CPC - A61B 8/546: {involving monitoring or regulation of device temperature} - A61B 8/12: in body cavities or body tracts, e.g. by using catheters - A61B 8/44: {Constructional features of the ultrasonic, sonic or infrasonic diagnostic device} - A61B 8/4444: {related to the probe} - A61B 8/4483: {characterised by features of the ultrasound transducer} - A61B 8/4488: {the transducer being a phased array} - A61B 8/4494: {characterised by the arrangement of the transducer elements} - B06B 1/0622: {on one surface} - A61B 1/128: {provided with means for regulating temperature} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) ## Abstract An ultrasonic endoscope has an ultrasonic vibrator array in which a plurality of ultrasonic vibrators are arrayed; a backing material layer that supports the ultrasonic vibrators; shield cables that each include a signal wire and a shield member for the signal wire; a flexible printed wiring board that extends on a side opposite to the ultrasonic vibrator array with respect to the backing material layer and that includes a ground portion electrically connected to the shield members; and a heat conductive layer that is provided on at least one surface of the flexible printed wiring board and connected to the ground portion, the heat conductive layer dissipating heat generated in the plurality of ultrasonic vibrators to the ground portion. ## Claims ### Claim 1 An ultrasonic endoscope comprising: an ultrasonic vibrator array in which a plurality of ultrasonic vibrators are arrayed; a backing material layer that supports the plurality of ultrasonic vibrators; a flexible printed wiring board that extends on a side opposite to the ultrasonic vibrator array with respect to the backing material layer and that comprises a plurality of electrode pads that are each electrically connected to a respective one of the plurality of ultrasonic vibrators of the ultrasonic vibrator array; a plurality of shield cables that each comprise a signal wire electrically connected to a respective one of the plurality of ultrasonic vibrators and that each comprise a shield member for a respective one of the plurality of signal wires; a wiring portion that comprises a plurality of connection portions in which the plurality of signal wires of the plurality of shield cables are each electrically connected to a respective one of the plurality of electrode pads of the flexible printed wiring board; a ground portion that is provided on the flexible printed wiring board and electrically connected to the shield members of the shield cables; and a heat conductive layer that is provided on at least one surface of the flexible printed wiring board and connected to the ground portion, the heat conductive layer dissipating heat generated in the plurality of ultrasonic vibrators to the ground portion; wherein the portion of the flexible printed wiring board extending beyond the backing material layer on the side opposite to the ultrasonic vibrator array with respect to the backing material layer is a flat surface portion, wherein the ground portion is provided on at least one surface of the flat surface portion, and wherein at least a part of the heat conductive layer is provided on at least one surface of the flat surface portion. ### Claim 2 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the heat conductive layer is provided on at least one surface of the flexible printed wiring board so as to be thermally connected to the plurality of ultrasonic vibrators of the ultrasonic vibrator array and so as to extend beyond the backing material layer from the ultrasonic vibrator array along the backing material layer to the side opposite to the ultrasonic vibrator array with respect to the backing material layer, the heat conductive layer being connected to the ground portion. ### Claim 3 (depends on 2) The ultrasonic endoscope according to claim 2, further comprising a first heat conductive member that thermally connects the plurality of ultrasonic vibrators of the ultrasonic vibrator array and the heat conductive layer to each other. ### Claim 4 (depends on 3) The ultrasonic endoscope according to claim 3, wherein the heat conductive layer is provided, at the portion of the flexible printed wiring board extending beyond the backing material layer, on only one side of the flat surface portion, and wherein the first heat conductive member thermally connects, on the one side of the flexible printed wiring board opposite to the backing material layer, the plurality of ultrasonic vibrators and the heat conductive layer to each other. ### Claim 5 (depends on 3) The ultrasonic endoscope according to claim 3, wherein the heat conductive layer includes two heat conductive layers provided on both surfaces of the flexible printed wiring board, wherein the first heat conductive member thermally connects, on one side of the flexible printed wiring board opposite to the backing material layer, the plurality of ultrasonic vibrators and the heat conductive layer that is provided on the one side to each other, and wherein the two heat conductive layers provided on the both surfaces of the flexible printed wiring board are thermally connected to each other. ### Claim 6 (depends on 1) The ultrasonic endoscope according to claim 1, further comprising a first heat conductive member that thermally connects the plurality of ultrasonic vibrators of the ultrasonic vibrator array and the heat conductive layer to each other. ### Claim 7 (depends on 6) The ultrasonic endoscope according to claim 6, wherein the heat conductive layer is provided, at the portion of the flexible printed wiring board extending beyond the backing material layer, on only one side of the flat surface portion, and wherein the first heat conductive member thermally connects, on the one side of the flexible printed wiring board opposite to the backing material layer, the plurality of ultrasonic vibrators and the heat conductive layer to each other. ### Claim 8 (depends on 6) The ultrasonic endoscope according to claim 6, wherein the heat conductive layer includes two heat conductive layers provided on both surfaces of the flexible printed wiring board, wherein the first heat conductive member thermally connects, on one side of the flexible printed wiring board opposite to the backing material layer, the plurality of ultrasonic vibrators and the heat conductive layer that is provided on the one side to each other, and wherein the two heat conductive layers provided on the both surfaces of the flexible printed wiring board are thermally connected to each other. ### Claim 9 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the heat conductive layer provided on a surface of the flexible printed wiring board on a side where the wiring portion is present is disposed at a portion excluding the plurality of connection portions of the wiring portion so as to surround the plurality of connection portions. ### Claim 10 (depends on 1) The ultrasonic endoscope according to claim 1, wherein the flexible printed wiring board includes a plurality of flexible printed wiring boards disposed on the side opposite to the ultrasonic vibrator array with respect to the backing material layer. ### Claim 11 (depends on 10) The ultrasonic endoscope according to claim 10, further comprising a second heat conductive member that connects the plurality of heat conductive layers that are each provided on a respective one of the plurality of flexible printed wiring boards to each other.