Implementing high-speed signaling via dedicated printed circuit-board media

A method comprising:

• forming a first circuit board that includes a first electronic component and an additional electronic component, said first electronic component including a plurality of leads, said first circuit board including first wires that connect to a first portion of the plurality of leads, said first circuit board further including a plurality of electrical connectors extending through a thickness of the first circuit board;
• and
• affixing a second circuit board to the first circuit board, said second circuit board including second wires, said second circuit board being smaller in size than the first circuit board;
• wherein the plurality of electrical connectors connect a second portion of the plurality of leads to the second wires, wherein the second circuit board is limited in size to approximately a distance between the first electronic component and the additional electronic component, wherein the distance between the electronic component and the additional electronic component is between approximately 5 inches to approximately 30 inches, and wherein the second wires include a spatial configuration on the second circuit board that has a signal-to-cross talk ratio of greater than 17 decibels for signal communications at greater than or equal to approximately 5 Gigabits per second for single ended signaling.