Brake pad and under-layer material composition
AssigneeAdvics Co., Ltd.
InventorsShusuke Suzuki, Katsuya Okayama, Masato Nishioka
Life of this patent
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Abstract
A brake pad according to an embodiment includes a friction material containing copper at 0.5 wt % or less, a back plate, and an under-layer material laminated between the friction material and the back plate and having an average loss modulus of 500 MPa or more at −50° C. to 0° C. in a bending mode.
Claims18
A brake pad comprising:
- a back plate;
- an under-layer material fixed to the back plate;
- a friction material fixed to the under-layer material so that the under-layer material is positioned between the back plate and the friction material;
- the friction material containing copper at 0.5 wt % or less;
- the under-layer material having an average loss modulus of 500 MPa or more at −50° C. to 0° C. in a bending mode.
An under-layer material composition used to fabricate an under-layer material configured to be fixed to a back plate and to have friction material containing copper at 0.5 wt % or less fixed to the under-layer material to form a brake pad, the under-layer material composition comprising:
- a composition of material that possesses an average loss modulus of 500 MPa or more at −50° C. to 0° C. in a bending mode.
A brake pad comprising:
- a back plate;
- an under-layer material fixed to the back plate;
- a friction material fixed to the under-layer material so that the under-layer material is positioned between the back plate and the friction material;
- the friction material containing copper at 0.5 wt % or less;
- the under-layer material being comprised of:
- i) a thermosetting resin;
- ii) a friction modifier;
- iii) rubber;
- and iv) aramid fiber;
- the under-layer material possessing an average loss modulus of 500 MPa or more at −50° C. to 0° C. in a bending mode.
Dependencies are inferred from the claim text.