Dressing apparatus and dressing method for substrate rear surface polishing member

A dressing method of a substrate rear surface polishing member for performing dressing of the polishing member configured to polish a rear surface of a substrate, the dressing method of the substrate rear surface polishing member comprising:

• by using a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate the polishing member from thereabove,
• at a position where the polishing member does not overlap with a substrate as a polishing target when viewed from the top,
• performing cleaning by supplying a cleaning liquid onto a polishing surface of the polishing member while rotating the polishing member within the bus member, and performing dressing by bringing a dressing member provided at the bus member into contact with the polishing surface of the polishing member while rotating the polishing member.

A dressing method of a substrate rear surface polishing member for performing dressing of the polishing member configured to polish a rear surface of a substrate, the dressing method of the substrate rear surface polishing member comprising:

• by using a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate the polishing member from thereabove,
• at a position where the polishing member does not overlap with a substrate as a polishing target when viewed from the top,
• performing cleaning by supplying a cleaning liquid onto a polishing surface of the polishing member within the bus member, and performing dressing by bringing a dressing member provided at the bus member into contact with the polishing surface of the polishing member while allowing the polishing member to revolve centering on a position other than a center of the polishing member.