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US 11,058,039 B2Granted
Composites for high frequency electromagnetic interference (EMI) applications
Assignee3M Innovative Properties Company
InventorsDipankar Ghosh, Jitendra S. Rathore
Life of this patent
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Abstract
Electromagnetic interference (EMI) shielding articles and methods of producing and using the same are described. The articles include electrically conductive fillers and silsesquioxane-like (SSQ-like) particles distributed inside a polymeric matrix material. In some cases, adding the SSQ-like particles leads to increased porosity of the articles which improves EMI absorbing performance.
Claims19
An electromagnetic interference (EMI) shielding article having a composition comprising:
- a plurality of electrically conductive fillers;
- a plurality of silsesquioxane-like (SSQ-like) particles;
- and
- a polymeric matrix material, the electrically conductive fillers and the SSQ-like particles being distributed inside the polymeric matrix material,
- wherein the composition comprises about 0.0005 wt. % to about 2 wt. % of the SSQ-like particles, and
- wherein the SSQ-like particles are present in the matrix material as particle aggregates having an average dimension from about one micron to about 10 microns.
3 more elements
A method of making an electromagnetic interference (EMI) shielding article, the method comprising:
- providing a plurality of electrically conductive fillers;
- providing a plurality of silsesquioxane-like (SSQ-like) particles;
- and
- adding a mixture of the electrically conductive fillers and the SSQ-like particles into a polymeric matrix material, the electrically conductive fillers and the SSQ-like particles being distributed inside the polymeric matrix material,
- wherein the composition comprises about 0.0005 wt. % to about 2 wt. % of the SSQ-like particles, and
- wherein the SSQ-like particles are present in the matrix material as particle aggregates having an average dimension from about one micron to about 10 microns.
3 more elements
Dependencies are inferred from the claim text.